Kang; Sa-Yoon

Patent Applications and Registrations

Patent applications and USPTO patent grants for Kang; Sa-Yoon.The latest application filed is for "semiconductor package".

Company Profile

0.43.54

Kang; Sa-Yoon - Seoul KR
Kang; Sa-yoon - Seocho-gu KR
Kang, Sa-Yoon - Dongjak-gu KR
Kang; Sa-Yoon - Kyungki-do KR
Kang; Sa-Yoon - Seould KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor package Grant 9,570,400 - Baek , et al. February 14, 2	2017-02-14
Semiconductor Package App 20150318226 - BAEK; Bo-Na ; et al.	2015-11-05
Chip on flexible printed circuit type semiconductor package Grant 8,575,746 - Lee , et al. November 5, 2	2013-11-05
Method for manufacturing tape wiring board Grant 8,250,750 - Choi , et al. August 28, 2	2012-08-28
Tape for heat dissipating member, chip on film type semiconductor package including heat dissipating member, and electronic apparatus including the same Grant 8,222,089 - Choi , et al. July 17, 2	2012-07-17
Display driver integrated circuit device, film, and module Grant 7,999,341 - Chung , et al. August 16, 2	2011-08-16
Tape For Heat Dissipating Member, Chip On Film Type Semiconductor Package Including Heat Dissipating Member, And Electronic Apparatus Including The Same App 20110143625 - Choi; Kyoung-sei ; et al.	2011-06-16
Method For Manufacturing Tape Wiring Board App 20110119912 - Choi; Kyoung-Sei ; et al.	2011-05-26
Tape circuit substrate with reduced size of base film Grant 7,948,768 - Park , et al. May 24, 2	2011-05-24
Tape for heat dissipating member, chip on film type semiconductor package including heat dissipating member, and electronic apparatus including the same Grant 7,915,727 - Choi , et al. March 29, 2	2011-03-29
TAB package connecting host device element Grant 7,902,647 - Chung , et al. March 8, 2	2011-03-08
Method for manufacturing tape wiring board Grant 7,895,742 - Choi , et al. March 1, 2	2011-03-01
Tape circuit substrate with reduced size of base film App 20100149775 - Park; Sang-Ho ; et al.	2010-06-17
Display Driver Integrated Circuit Device, Film, And Module App 20100141617 - CHUNG; Ye-chung ; et al.	2010-06-10
Semiconductor chip and TAB package having the same Grant 7,732,933 - Chung , et al. June 8, 2	2010-06-08
Tab Package Connecting Host Device Element App 20100072607 - Chung; Ye-chung ; et al.	2010-03-25
Display driver integrated circuit device, film, and module Grant 7,683,471 - Chung , et al. March 23, 2	2010-03-23
Semiconductor package film having reinforcing member and related display module Grant 7,683,476 - Lee , et al. March 23, 2	2010-03-23
Tab package connecting host device element Grant 7,649,246 - Chung , et al. January 19, 2	2010-01-19
Tape for heat dissipating member, chip on film type semiconductor package including heat dissipating member, and elctronic apparatus including the same App 20090273076 - CHOI; Kyong-sei ; et al.	2009-11-05
Tape circuit substrate with reduced size of base film Grant 7,599,193 - Park , et al. October 6, 2	2009-10-06
Image pickup device with non-molded DSP chip and manufacturing method Grant 7,405,760 - Cho , et al. July 29, 2	2008-07-29
Semiconductor Chip And Tab Package Having The Same App 20080128902 - CHUNG; Ye-Chung ; et al.	2008-06-05
Semiconductor package Grant 7,375,426 - Kang , et al. May 20, 2	2008-05-20
Chip-on-board Package Having Flip Chip Assembly Structure And Manufacturing Method Thereof App 20080081456 - KIM; Dong-Han ; et al.	2008-04-03
Tape circuit substrate and semiconductor apparatus employing the same Grant 7,339,262 - Son , et al. March 4, 2	2008-03-04
Semiconductor chip and tab package having the same Grant 7,329,597 - Chung , et al. February 12, 2	2008-02-12
Method For Manufacturing Tape Wiring Board App 20080029923 - CHOI; Kyoung-Sei ; et al.	2008-02-07
Chip on flexible printed circuit type semiconductor package App 20080023822 - Lee; Si-Hoon ; et al.	2008-01-31
Chip-on-board package having flip chip assembly structure and manufacturing method thereof Grant 7,315,086 - Kim , et al. January 1, 2	2008-01-01
Semiconductor package and method for its manufacture Grant 7,309,916 - Kang , et al. December 18, 2	2007-12-18
Method for manufacturing tape wiring board Grant 7,299,547 - Choi , et al. November 27, 2	2007-11-27
Circuit Film With Bump, Film Package Using The Same, And Related Fabrication Methods App 20070126110 - KWON; Yong-Hwan ; et al.	2007-06-07
Semiconductor chip, chip stack package and manufacturing method Grant 7,208,343 - Song , et al. April 24, 2	2007-04-24
Semiconductor package film having reinforcing member and related display module App 20070057360 - Lee; Si-hoon ; et al.	2007-03-15
Circuit film with bump, film package using the same, and related fabrication methods Grant 7,190,073 - Kwon , et al. March 13, 2	2007-03-13
Tape circuit substrate and semicondutor chip package using the same Grant 7,183,660 - Lee , et al. February 27, 2	2007-02-27
Display driver integrated circuit device, film, and module App 20070013857 - Chung; Ye-chung ; et al.	2007-01-18
Tab package connecting host device element App 20060267164 - Chung; Ye-chung ; et al.	2006-11-30
Low-cost flexible film package module and method of manufacturing the same App 20060268213 - Kang; Sa-Yoon ; et al.	2006-11-30
Stacked chip package having upper chip provided with trenches and method of manufacturing the same Grant 7,115,483 - Kwon , et al. October 3, 2	2006-10-03
Low-cost flexible film package module and method of manufacturing the same Grant 7,109,575 - Kang , et al. September 19, 2	2006-09-19
Method Of Forming Redistribution Bump And Semiconductor Chip And Mount Structure Fabricated Using The Same App 20060202334 - KWON; Yong-Hwan ; et al.	2006-09-14
Method of forming redistribution bump and semiconductor chip and mount structure fabricated using the same Grant 7,078,331 - Kwon , et al. July 18, 2	2006-07-18
Bump formed on semiconductor device chip and method for manufacturing the bump Grant 7,074,704 - Kwon , et al. July 11, 2	2006-07-11
Semiconductor chip and tab package having the same App 20060113648 - Chung; Ye-Chung ; et al.	2006-06-01
Film circuit substrate having Sn-In alloy layer App 20060091504 - Kang; Un-Byoung ; et al.	2006-05-04
Chip-on-board package having flip chip assembly structure and manufacturing method thereof App 20060091511 - Kim; Dong-Han ; et al.	2006-05-04
Camera module and method of fabricating the same App 20060082673 - Kim; Dong-Han ; et al.	2006-04-20
Film substrate of a semiconductor package and a manufacturing method App 20060071303 - Lee; Chung-Sun ; et al.	2006-04-06
Semiconductor package App 20060012019 - Kang; Suk-Chae ; et al.	2006-01-19
Semiconductor package and method for its manufacture App 20060012026 - Kang; Suk-Chae ; et al.	2006-01-19
Method for manufacturing tape wiring board App 20060003568 - Choi; Kyoung-Sei ; et al.	2006-01-05
Circuit film with bump, film package using the same, and related fabrication methods App 20050285277 - Kwon, Yong-Hwan ; et al.	2005-12-29
Method of manufacturing tape wiring substrate App 20050205524 - Lee, Chung-Sun ; et al.	2005-09-22
Tape circuit substrate with reduced size of base film App 20050121796 - Park, Sang-Ho ; et al.	2005-06-09
Chip scale packages manufactured at wafer level Grant 6,903,451 - Kim , et al. June 7, 2	2005-06-07
Method and apparatus for bonding a flexible printed circuit cable to an ink jet print head assembly Grant 6,902,261 - Kim , et al. June 7, 2	2005-06-07
Semiconductor chip, tape carrier package having the same mounted thereon, and liquid crystal display apparatus including the tape carrier package App 20050110935 - Kim, Dong-Han ; et al.	2005-05-26
Semiconductor chip, chip stack package and manufacturing method App 20050101056 - Song, Young Hee ; et al.	2005-05-12
Tape circuit substrate and semiconductor apparatus employing the same App 20050093114 - Son, Dae-Woo ; et al.	2005-05-05
Tape circuit substrate and semiconductor chip package using the same App 20050082647 - Lee, Si-Hoon ; et al.	2005-04-21
Stacked chip package having upper chip provided with trenches and method of manufacturing the same App 20050051882 - Kwon, Yong Hwan ; et al.	2005-03-10
Low-cost flexible film package module and method of manufacturing the same App 20050040504 - Kang, Sa-Yoon ; et al.	2005-02-24
Semiconductor chip, chip stack package and manufacturing method Grant 6,849,802 - Song , et al. February 1, 2	2005-02-01
Method of forming redistribution bump and semiconductor chip and mount structure fabricated using the same App 20050017343 - Kwon, Yong-Hwan ; et al.	2005-01-27
Solid-state imaging method and apparatus App 20040263668 - Kim, Dong-Han ; et al.	2004-12-30
Solid-state imaging apparatus and method for making the same App 20040263667 - Lee, Kwan-Jai ; et al.	2004-12-30
Wafer level package and method for manufacturing the same Grant 6,836,018 - Kim , et al. December 28, 2	2004-12-28
Package and method for bonding between gold lead and gold bump App 20040251546 - Lee, Si-Hoon ; et al.	2004-12-16
Stacked chip package having upper chip provided with trenches and method of manufacturing the same Grant 6,818,998 - Kwon , et al. November 16, 2	2004-11-16
Bump formed on semiconductor device chip and method for manufacturing the bump App 20040219715 - Kwon, Yong-Hwan ; et al.	2004-11-04
Semiconductor devices with bonding pads having intermetal dielectric layer of hybrid configuration and methods of fabricating the same Grant 6,791,196 - Kwon , et al. September 14, 2	2004-09-14
Reinforced bond-pad substructure and method for fabricating the same Grant 6,717,272 - Lee , et al. April 6, 2	2004-04-06
Image pickup device and manufacturing method thereof App 20030234886 - Cho, Min Kyo ; et al.	2003-12-25
Method and apparatus for bonding a flexible printed circuit cable to an ink jet print head assembly App 20030214558 - Kim, Jeong-Seon ; et al.	2003-11-20
Bump formed on semiconductor device chip and method for manufacturing the bump App 20030214035 - Kwon, Yong-Hwan ; et al.	2003-11-20
Reinforced bond-pad substructure and method for fabricating the same App 20030178644 - Lee, Jin-Hyuk ; et al.	2003-09-25
Wafer level stack chip package and method for manufacturing same Grant 6,607,938 - Kwon , et al. August 19, 2	2003-08-19
Semiconductor chip, chip stack package and manufacturing method App 20030146012 - Song, Young Hee ; et al.	2003-08-07
Wafer level package and method for manufacturing the same Grant 6,586,275 - Kim , et al. July 1, 2	2003-07-01
Semiconductor devices with bonding pads having intermetal dielectric layer of hybrid configuration and methods of fabricating the same App 20030102475 - Kwon, Dong Whee ; et al.	2003-06-05
Wafer level package and method for manufacturing the same App 20030102560 - Kim, Gu-Sung ; et al.	2003-06-05
Wafer level package and method for manufacturing the same Grant 6,518,675 - Kim , et al. February 11, 2	2003-02-11
Wafer level stack chip package and method for manufacturing same App 20030017647 - Kwon, Yong Hwan ; et al.	2003-01-23
Stacked chip package having upper chip provided with trenches and method of manufacturing the same App 20030001281 - Kwon, Yong Hwan ; et al.	2003-01-02
Three-dimensional multi-chip package having chip selection pads and manufacturing method thereof Grant 6,448,661 - Kim , et al. September 10, 2	2002-09-10
Three-dimensional Multi-chip Package Having Chip Selection Pads And Manufacturing Method Thereof App 20020109236 - Kim, Hyeong-Seob ; et al.	2002-08-15
Wafer level package and method for manufacturing the same App 20020100982 - Kim, Gu-Sung ; et al.	2002-08-01
Wafer level package and method for manufacturing the same App 20020084528 - Kim, Gu-Sung ; et al.	2002-07-04
method for manufacturing a semiconductor package Grant 6,376,279 - Kwon , et al. April 23, 2	2002-04-23
Method For Manufacturing A Semiconductor Package App 20020022301 - Kwon, Yong Hwan ; et al.	2002-02-21
Semiconductor package App 20020017711 - Kwon, Yong Hwan ; et al.	2002-02-14
Chip scale package App 20010020737 - Kwon, Yong Hwan ; et al.	2001-09-13
Chip scale package and method for manufacturing the same using a redistribution substrate Grant 6,235,552 - Kwon , et al. May 22, 2	2001-05-22
Chip scale packages and methods for manufacturing the chip scale packages at wafer level Grant 6,187,615 - Kim , et al. February 13, 2	2001-02-13

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