| Patent | Date |
|---|
Semiconductor laser device
Grant 11,283,235 - Kang , et al. March 22, 2 | 2022-03-22 |
Method Of Fabricating A Semiconductor Device
App 20220068852 - CHOI; Ju-Il ; et al. | 2022-03-03 |
Semiconductor Device
App 20210335707 - SASAKI; Yuichiro ; et al. | 2021-10-28 |
Semiconductor device including interconnection structure including copper and tin and semiconductor package including the same
Grant 11,152,317 - Choi , et al. October 19, 2 | 2021-10-19 |
Semiconductor device
Grant 11,121,080 - Sasaki , et al. September 14, 2 | 2021-09-14 |
Three-dimensional Semiconductor Devices
App 20210020628 - OH; SEUNGHA ; et al. | 2021-01-21 |
Semiconductor Device
App 20200365509 - Sasaki; Yuichiro ; et al. | 2020-11-19 |
Wafer bonding apparatus and wafer bonding system including the same
Grant 10,639,875 - Kim , et al. | 2020-05-05 |
Semiconductor Laser Device
App 20200136341 - KANG; Pil-Kyu ; et al. | 2020-04-30 |
Semiconductor Device And Semiconductor Package Including The Same
App 20200098711 - CHOI; Ju-Il ; et al. | 2020-03-26 |
Method of manufacturing substrate structure
Grant 10,468,400 - Kang , et al. No | 2019-11-05 |
Wafer Bonding Apparatus And Wafer Bonding System Including The Same
App 20180370210 - Kim; Tae-yeong ; et al. | 2018-12-27 |
Method Of Manufacturing Substrate Structure
App 20180226390 - KANG; Pil Kyu ; et al. | 2018-08-09 |
Wafer-to-wafer bonding structure
Grant 9,941,243 - Kim , et al. April 10, 2 | 2018-04-10 |
Multi-stacked device having TSV structure
Grant 9,935,037 - Kang , et al. April 3, 2 | 2018-04-03 |
Method of fabricating multi-substrate semiconductor devices
Grant 9,865,581 - Jang , et al. January 9, 2 | 2018-01-09 |
Semiconductor devices having through-electrodes and methods for fabricating the same
Grant 9,847,276 - Kang , et al. December 19, 2 | 2017-12-19 |
Wafer-to-wafer Bonding Structure
App 20170358553 - KIM; TAE-YEONG ; et al. | 2017-12-14 |
Semiconductor device and method of fabricating the same
Grant 9,831,164 - Moon , et al. November 28, 2 | 2017-11-28 |
Wafer processing methods
Grant 9,773,660 - Kim , et al. September 26, 2 | 2017-09-26 |
Multi-stacked Device Having Tsv Structure
App 20170207158 - KANG; Pil-kyu ; et al. | 2017-07-20 |
Semiconductor devices having stacked structures and methods for fabricating the same
Grant 9,653,430 - Kim , et al. May 16, 2 | 2017-05-16 |
Semiconductor Devices Having Hybrid Stacking Structures And Methods Of Fabricating The Same
App 20170110445 - KANG; PIL-KYU ; et al. | 2017-04-20 |
Wafer carrier having cavity
Grant 9,583,373 - Lee , et al. February 28, 2 | 2017-02-28 |
Semiconductor devices having hybrid stacking structures and methods of fabricating the same
Grant 9,530,706 - Kang , et al. December 27, 2 | 2016-12-27 |
Semiconductor device and method of fabricating the same
Grant 9,530,726 - Moon , et al. December 27, 2 | 2016-12-27 |
Semiconductor devices
Grant 9,520,361 - Kang , et al. December 13, 2 | 2016-12-13 |
Wafer-to-wafer bonding structure
Grant 9,461,007 - Chun , et al. October 4, 2 | 2016-10-04 |
Semiconductor devices having through-vias and methods for fabricating the same
Grant 9,362,172 - Lee , et al. June 7, 2 | 2016-06-07 |
Semiconductor Devices Having Stacked Structures And Methods For Fabricating The Same
App 20160155724 - Kim; Taeyeong ; et al. | 2016-06-02 |
Method Of Fabricating Multi-substrate Semiconductor Devices
App 20160141282 - Jang; Joo-Hee ; et al. | 2016-05-19 |
Semiconductor Devices
App 20160141249 - Kang; Pil-Kyu ; et al. | 2016-05-19 |
Semiconductor devices having through-electrodes and methods for fabricating the same
Grant 9,312,171 - Han , et al. April 12, 2 | 2016-04-12 |
Method of manufacturing a semiconductor device
Grant 9,287,251 - Kang , et al. March 15, 2 | 2016-03-15 |
Method of Manufacturing a Semiconductor Device
App 20160020197 - Kang; Pil-Kyu ; et al. | 2016-01-21 |
Wafer-to-wafer Bonding Structure
App 20160013160 - CHUN; Jin-ho ; et al. | 2016-01-14 |
Semiconductor device including through via structures and redistribution structures
Grant 9,236,349 - Lee , et al. January 12, 2 | 2016-01-12 |
Semiconductor devices having conductive via structures and methods for fabricating the same
Grant 9,171,753 - Lee , et al. October 27, 2 | 2015-10-27 |
Semiconductor Devices Having Hybrid Stacking Structures And Methods Of Fabricating The Same
App 20150279825 - KANG; Pil-Kyu ; et al. | 2015-10-01 |
Semiconductor Devices Having Through-vias And Methods For Fabricating The Same
App 20150243637 - Kang; Pil-Kyu ; et al. | 2015-08-27 |
Semiconductor devices having optical transceiver
Grant 9,103,974 - Kang , et al. August 11, 2 | 2015-08-11 |
Semiconductor devices having through-vias and methods for fabricating the same
Grant 9,070,748 - Kang , et al. June 30, 2 | 2015-06-30 |
Semiconductor packages, methods of manufacturing the same, and semiconductor package structures including the same
Grant 9,064,941 - Jung , et al. June 23, 2 | 2015-06-23 |
Semiconductor Devices Having Through-electrodes And Methods For Fabricating The Same
App 20150155233 - Han; Kyu-Hee ; et al. | 2015-06-04 |
Semiconductor Devices Having Through-electrodes And Methods For Fabricating The Same
App 20150137326 - KANG; Pil-Kyu ; et al. | 2015-05-21 |
Semiconductor Packages, Methods Of Manufacturing The Same, And Semiconductor Package Structures Including The Same
App 20150132950 - JUNG; Deok-young ; et al. | 2015-05-14 |
Semiconductor Devices Having Through-vias And Methods For Fabricating The Same
App 20150093896 - Lee; Kyu-Ha ; et al. | 2015-04-02 |
Semiconductor packages, methods of manufacturing the same, and semiconductor package structures including the same
Grant 8,963,336 - Jung , et al. February 24, 2 | 2015-02-24 |
Via connection structures, semiconductor devices having the same, and methods of fabricating the structures and devices
Grant 8,952,543 - Lee , et al. February 10, 2 | 2015-02-10 |
Semiconductor devices having through-vias and methods for fabricating the same
Grant 8,941,216 - Lee , et al. January 27, 2 | 2015-01-27 |
Semiconductor devices having through-vias and methods for fabricating the same
Grant 8,927,426 - Lee , et al. January 6, 2 | 2015-01-06 |
Optical input/output device and method of fabricating the same
Grant 8,901,694 - Kang , et al. December 2, 2 | 2014-12-02 |
Semiconductor Packages, Methods Of Manufacturing The Same, And Semiconductor Package Structures Including The Same
App 20140327150 - JUNG; Deok-young ; et al. | 2014-11-06 |
Buried-type optical input/output devices and methods of manufacturing the same
Grant 8,873,901 - Kang , et al. October 28, 2 | 2014-10-28 |
Photodetector structures including cross-sectional waveguide boundaries
Grant 8,866,187 - Na , et al. October 21, 2 | 2014-10-21 |
Optical input/output device for photo-electric integrated circuit device and method of fabricating same
Grant 8,867,882 - Kang , et al. October 21, 2 | 2014-10-21 |
Optical modulator formed on bulk-silicon substrate
Grant 8,842,942 - Shin , et al. September 23, 2 | 2014-09-23 |
Semiconductor Device and Method of Fabricating the Same
App 20140217603 - Moon; Kwang-jin ; et al. | 2014-08-07 |
Optical waveguide and coupler apparatus and method of manufacturing the same
Grant 8,791,405 - Ji , et al. July 29, 2 | 2014-07-29 |
Methods for Forming Semiconductor Devices Using Sacrificial Layers
App 20140199810 - Park; Jin-Ho ; et al. | 2014-07-17 |
Semiconductor Devices Having Through-vias And Methods For Fabricating The Same
App 20140179103 - Kang; Pil-Kyu ; et al. | 2014-06-26 |
Methods of selectively forming silicon-on-insulator structures using selective expitaxial growth process
Grant 8,735,265 - Kang , et al. May 27, 2 | 2014-05-27 |
Photodetector structure and method of manufacturing the same
Grant 8,728,850 - Ji , et al. May 20, 2 | 2014-05-20 |
Wafer Carrier Having Cavity
App 20140110894 - Lee; Ho-Jin ; et al. | 2014-04-24 |
Wafer Processing Methods
App 20140106649 - KIM; Tae-yeong ; et al. | 2014-04-17 |
Semiconductor Device Including Through Via Structures And Redistribution Structures
App 20140048952 - Lee; Kyu-Ha ; et al. | 2014-02-20 |
Semiconductor Device and Method of Fabricating the Same
App 20140035164 - Moon; Kwang-jin ; et al. | 2014-02-06 |
Semiconductor devices including protected barrier layers
Grant 8,564,139 - Lee , et al. October 22, 2 | 2013-10-22 |
Method for forming light guide layer in semiconductor substrate
Grant 8,546,162 - Bae , et al. October 1, 2 | 2013-10-01 |
Optical Input/output Device For Photo-electric Integrated Circuit Device And Method Of Fabricating Same
App 20130224935 - KANG; Pil-Kyu ; et al. | 2013-08-29 |
Semiconductor Devices Having Conductive Via Structures And Methods For Fabricating The Same
App 20130210222 - LEE; Ho-Jin ; et al. | 2013-08-15 |
Semiconductor Devices Having Through-Vias and Methods for Fabricating the Same
App 20130207241 - Lee; Kyu-Ha ; et al. | 2013-08-15 |
Semiconductor Devices Having Through-Vias and Methods for Fabricating the Same
App 20130207242 - Lee; Ho-Jin ; et al. | 2013-08-15 |
Via Connection Structures, Semiconductor Devices Having The Same, And Methods Of Fabricating The Structures And Devices
App 20130200525 - LEE; Ho-Jin ; et al. | 2013-08-08 |
Semiconductor Devices Including Protected Barrier Layers
App 20130134603 - Lee; Ho-Jin ; et al. | 2013-05-30 |
Photodetector Structures Including Cross-sectional Waveguide Boundaries
App 20130092980 - Na; Kyoung Won ; et al. | 2013-04-18 |
Optical input/output device for photo-electric integrated circuit device and method of fabricating same
Grant 8,422,845 - Kang , et al. April 16, 2 | 2013-04-16 |
Optical Input/output Device And Method Of Fabricating The Same
App 20130062719 - KANG; Pil-Kyu ; et al. | 2013-03-14 |
Semiconductor device and method of fabricating the same
Grant 8,390,120 - Moon , et al. March 5, 2 | 2013-03-05 |
Stacked Integrated Circuit Packages That Include Monolithic Conductive Vias
App 20130049225 - KANG; Pil-kyu ; et al. | 2013-02-28 |
Conductive layer buried-type substrate, method of forming the conductive layer buried-type substrate, and method of fabricating semiconductor device using the conductive layer buried-type substrate
Grant 8,354,308 - Kang , et al. January 15, 2 | 2013-01-15 |
Wafer temporary bonding method using silicon direct bonding
Grant 8,343,851 - Kim , et al. January 1, 2 | 2013-01-01 |
Buried-type Optical Input/output Devices And Methods Of Manufacturing The Same
App 20120314993 - Kang; Pil-Kyu ; et al. | 2012-12-13 |
Semiconductor Devices Having Optical Transceiver
App 20120314991 - Kang; Pil-Kyu ; et al. | 2012-12-13 |
Methods of manufacturing buried wiring type substrate and semiconductor device incorporating buried wiring type substrate
Grant 8,324,055 - Kang , et al. December 4, 2 | 2012-12-04 |
Stacked integrated circuit package having recessed sidewalls
Grant 8,319,329 - Kang , et al. November 27, 2 | 2012-11-27 |
Gettering structures and methods and their application
Grant 8,293,613 - Park , et al. October 23, 2 | 2012-10-23 |
Semiconductor Devices And Methods Of Manufacturing The Same
App 20120132986 - Kang; Pil-Kyu ; et al. | 2012-05-31 |
Stacked Integrated Circuit Package Fabrication Methods That Use Vias Formed And Filled After Stacking, And Related Stacked Integrated Circuit Package Structures
App 20120119383 - Kang; Pil-kyu ; et al. | 2012-05-17 |
Substrate Structure Having Buried Wiring And Method For Manufacturing The Same, And Semiconductor Device And Method For Manufacturing The Same Using The Substrate Structure
App 20120108034 - Bae; Dae-Lok ; et al. | 2012-05-03 |
Methods of manufacturing nonvolatile memory devices
Grant 8,163,616 - Kang , et al. April 24, 2 | 2012-04-24 |
Method For Forming Light Guide Layer In Semiconductor Substrate
App 20120088323 - BAE; DAE-LOK ; et al. | 2012-04-12 |
Stacked integrated circuit packages that include monolithic conductive vias
Grant 8,129,833 - Kang , et al. March 6, 2 | 2012-03-06 |
Conductive Layer Buried-type Substrate, Method Of Forming The Conductive Layer Buried-type Substrate, And Method Of Fabricating Semiconductor Device Using The Conductive Layer Buried-type Substrate
App 20120052635 - Kang; Pil-kyu ; et al. | 2012-03-01 |
Photoelectric Integrated Circuit Devices And Methods Of Forming The Same
App 20120039564 - Kang; Pil-Kyu ; et al. | 2012-02-16 |
Photodetector Structure And Method Of Manufacturing The Same
App 20120025265 - JI; Ho-Chul ; et al. | 2012-02-02 |
Methods of Manufacturing Nonvolatile Memory Devices
App 20120009747 - Kang; Pil-Kyu ; et al. | 2012-01-12 |
Semiconductor Device and Method of Fabricating the Same
App 20110316168 - Moon; Kwang-Jin ; et al. | 2011-12-29 |
Methods of fabricating nonvolatile memory devices
Grant 8,053,829 - Kang , et al. November 8, 2 | 2011-11-08 |
Methods of manufacturing semiconductor devices including a doped silicon layer
Grant 8,048,784 - Kang , et al. November 1, 2 | 2011-11-01 |
Methods Of Selectively Forming Silicon-on-insulator Structures Using Selective Expitaxial Growth Process
App 20110250738 - Kang; Pil-Kyu ; et al. | 2011-10-13 |
Silicon Based Optical Modulators And Methods Of Fabricating The Same
App 20110243492 - NA; Kyoung-won ; et al. | 2011-10-06 |
Methods Of Manufacturing Buried Wiring Type Substrate And Semiconductor Device Incorporating Buried Wiring Type Substrate
App 20110223725 - KANG; Pil-Kyu ; et al. | 2011-09-15 |
Optical Modulator Formed On Bulk-silicon Substrate
App 20110194803 - SHIN; Dong-jae ; et al. | 2011-08-11 |
Optical Input/output Device For Photo-electric Integrated Circuit Device And Method Of Fabricating Same
App 20110188828 - KANG; Pil-Kyu ; et al. | 2011-08-04 |
Optical waveguide and coupler apparatus and method of manufacturing the same
App 20110133063 - Ji; Ho-chul ; et al. | 2011-06-09 |
Gettering structures and methods and their application
App 20110076838 - Park; Young-Soo ; et al. | 2011-03-31 |
Methods Of Manufacturing Integrated Circuit Devices Including A Transcription-preventing Pattern
App 20100330753 - Kang; Pil-Kyu ; et al. | 2010-12-30 |
Integrated circuit devices including a transcription-preventing pattern
Grant 7,816,735 - Kang , et al. October 19, 2 | 2010-10-19 |
Nonvolatile Memory Devices
App 20100140685 - Kang; Pil-Kyu ; et al. | 2010-06-10 |
Stacked Integrated Circuit Package Fabrication Methods That Use Vias Formed And Filled After Stacking, And Related Stacked Integrated Circuit Package Structures
App 20100109164 - Kang; Pil-kyu ; et al. | 2010-05-06 |
Methods of laterally forming single crystalline thin film regions from seed layers
Grant 7,700,461 - Son , et al. April 20, 2 | 2010-04-20 |
Wafer temporary bonding method using silicon direct bonding
App 20100068868 - Kim; Jung-ho ; et al. | 2010-03-18 |
Methods of Fabricating Silicon on Insulator (SOI) Wafers
App 20090221133 - Choi; Seung-Woo ; et al. | 2009-09-03 |
Method of fabricating semiconductor device having thin strained relaxation buffer pattern and related device
App 20090142892 - Lee; Byeong-Chan ; et al. | 2009-06-04 |
Methods of manufacturing semiconductor devices including a doped silicon layer
App 20090104759 - Kang; Pil-Kyu ; et al. | 2009-04-23 |
Methods of fabricating semiconductor devices having laser-formed single crystalline active structures
Grant 7,470,603 - Cha , et al. December 30, 2 | 2008-12-30 |
Gettering structures and methods and their application
App 20080224269 - Park; Young-Soo ; et al. | 2008-09-18 |
Methods of Laterally Forming Single Crystalline Thin Film Regions from Seed Layers
App 20080194083 - Son; Yong-Hoon ; et al. | 2008-08-14 |
Integrated circuit devices including a transcription-preventing pattern and methods of manufacturing the same
App 20080093601 - Kang; Pil-Kyu ; et al. | 2008-04-24 |
Methods of fabricating semiconductor devices having laser-formed single crystalline active structures
App 20080014726 - Cha; Yong-Won ; et al. | 2008-01-17 |
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