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Patent applications and USPTO patent grants for Kang; Pierson S..The latest application filed is for "die assembly".
Patent | Date |
---|---|
Die assembly Grant 6,968,769 - Kang November 29, 2 | 2005-11-29 |
Die assembly App 20040045427 - Kang, Pierson S. | 2004-03-11 |
Perforating and slitting die sheet, methods of constructing same and paper product produced therefrom Grant 5,789,050 - Kang August 4, 1 | 1998-08-04 |
Magnetic saddle for non-magnetic die-cutting cylinders Grant 5,379,671 - Kang January 10, 1 | 1995-01-10 |
Method of making cutting, scoring and embossing die set Grant 4,112,827 - Kang September 12, 1 | 1978-09-12 |
Cutting And Scoring Die Grant 3,863,550 - Sarka , et al. February 4, 1 | 1975-02-04 |
Die And Method For Cutting Labels And The Like Grant 3,850,059 - Kang November 26, 1 | 1974-11-26 |
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