KANG; Myung-Sung

Patent Applications and Registrations

Patent applications and USPTO patent grants for KANG; Myung-Sung.The latest application filed is for "thermal conductive film".

Company Profile

7.9.13

KANG; Myung-Sung - Yongin-si KR
Kang; Myung Sung - Gunpo KR
Kang; Myung-Sung - Hwaseong-si KR
Kang; Myung-Sung - Seoul KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Thermal Conductive Film App 20220246491 - LEE; Joungphil ; et al.	2022-08-04
Adhesive film, semiconductor apparatus using the same, and semiconductor package including the same Grant 11,355,413 - Lee , et al. June 7, 2	2022-06-07
Elastic Material Vibration Test Apparatus App 20210356353 - Lim; Byungguk ; et al.	2021-11-18
Semiconductor device having stacked semiconductor chips and method for fabricating the same Grant 10,923,465 - Chang , et al. February 16, 2	2021-02-16
Flip chip bonding method Grant 10,910,339 - Jin , et al. February 2, 2	2021-02-02
Adhesive Film, Semiconductor Apparatus Using The Same, And Semiconductor Package Including The Same App 20200211920 - LEE; Joungphil ; et al.	2020-07-02
Flip Chip Bonding Method App 20200058615 - JIN; HWAIL ; et al.	2020-02-20
Semiconductor package Grant 10,446,525 - Choi , et al. Oc	2019-10-15
Semiconductor Device Having Stacked Semiconductor Chips And Method For Fabricating The Same App 20190273075 - Chang; Won-Gi ; et al.	2019-09-05
Semiconductor device having stacked semiconductor chips and method for fabricating the same Grant 10,354,985 - Chang , et al. July 16, 2	2019-07-16
Semiconductor Package App 20180350779 - CHOI; Yong-won ; et al.	2018-12-06
Semiconductor package Grant 10,043,780 - Choi , et al. August 7, 2	2018-08-07
Semiconductor package Grant 9,991,234 - Seo , et al. June 5, 2	2018-06-05
Semiconductor Package App 20180012866 - CHOI; Yong-won ; et al.	2018-01-11
Semiconductor Device Having Stacked Semiconductor Chips And Method For Fabricating The Same App 20170365591 - CHANG; WON-GI ; et al.	2017-12-21
Semiconductor Package App 20170365582 - Seo; Gwang Sun ; et al.	2017-12-21
Bi-directional camera module and flip chip bonder including the same Grant 8,958,011 - Park , et al. February 17, 2	2015-02-17
Bi-directional Camera Module And Flip Chip Bonder Including The Same App 20130258188 - PARK; Sang-Sick ; et al.	2013-10-03
Semiconductor Package And Method Of Manufacturing The Same App 20130032947 - Park; Sang-sick ; et al.	2013-02-07
Backgrinding-underfill film, method of forming the same, semiconductor package using the backgrinding-underfill film, and method of forming the semiconductor package Grant 7,807,507 - Kim , et al. October 5, 2	2010-10-05
Backgrinding-underfill Film, Method Of Forming The Same, Semiconductor Package Using The Backgrinding-underfill Film, And Method Of Forming The Semiconductor Package App 20100047969 - KIM; WON-KEUN ; et al.	2010-02-25

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