Kang; Kun A

Patent Applications and Registrations

Patent applications and USPTO patent grants for Kang; Kun A.The latest application filed is for "singulation method used in leadless packaging process".

Company Profile

0.10.5

Kang; Kun A - Paju-Si KR
Kang; Kun-A - Seoul KR
Kang, Kun A. - Paju-Si KP
Kang; Kun-A - Kyunggi-Do KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Singulation method used in leadless packaging process Grant 7,205,658 - Lee , et al. April 17, 2	2007-04-17
Low-pin-count chip package and manufacturing method thereof Grant 6,861,295 - Jung , et al. March 1, 2	2005-03-01
Singulation method used in leadless packaging process App 20050037618 - Lee, Jun Hong ; et al.	2005-02-17
Singulation method used in leadless packaging process Grant 6,773,961 - Lee , et al. August 10, 2	2004-08-10
Low-pin-count chip package and manufacturing method thereof Grant 6,528,893 - Jung , et al. March 4, 2	2003-03-04
Singulation Method Used In Leadless Packaging Process App 20020197826 - Kim, Hyeongno ; et al.	2002-12-26
Low-pin-count chip package and manufacturing method thereof Grant 6,495,909 - Jung , et al. December 17, 2	2002-12-17
Low-pin-count chip package and manufacturing method thereof App 20020056926 - Jung, Kyujin ; et al.	2002-05-16
Semiconductor package and method for making the same Grant 6,355,502 - Kang , et al. March 12, 2	2002-03-12
Low-pin-count chip package and manufacturing method thereof App 20020024147 - Jung, Kyujin ; et al.	2002-02-28
Low-pin-count chip package and manufacturing method thereof Grant 6,342,730 - Jung , et al. January 29, 2	2002-01-29
Low-pin-count chip package and manufacturing method thereof Grant 6,333,252 - Jung , et al. December 25, 2	2001-12-25
Low-pin-count chip package and manufacturing method thereof App 20010049156 - Jung, Kyujin ; et al.	2001-12-06
Low-pin-count chip package and manufacturing method thereof Grant 6,261,864 - Jung , et al. July 17, 2	2001-07-17
Method for packaging a semiconductor chip Grant 6,242,284 - Kang , et al. June 5, 2	2001-06-05

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