KANG; Jung Kun
Patent Applications and Registrations
Patent applications and USPTO patent grants for KANG; Jung Kun.The latest application filed is for "boron carbide sintered body and etcher including the same".
- KANG; Jung Kun - Pyeongtaek-si KR
- Kang; Jung-Kun - Kaohsiung TW
- Kang; Jung-Kun - Kaoshiung TW
- Kang, Jung-Kun - Kaohsiung City TW
| Patent | Date |
|---|---|
| Boron Carbide Sintered Body And Etcher Including The Same App 20200062654 - HWANG; Sung Sic ; et al. | 2020-02-27 |
| Ring-shaped Element For Etcher And Method For Etching Substrate Using The Same App 20200051793 - HWANG; Sung Sic ; et al. | 2020-02-13 |
| Multi-chip module with embedded package and method for manufacturing the same Grant 7,417,322 - Kang August 26, 2 | 2008-08-26 |
| Multi-chip stack package Grant 7,218,006 - Kang , et al. May 15, 2 | 2007-05-15 |
| Multi-chip stack package App 20060091560 - Kang; Jung-Kun ; et al. | 2006-05-04 |
| Stacked chip-packaging structure Grant 7,026,709 - Tsai , et al. April 11, 2 | 2006-04-11 |
| Manufacturing method of ball grid array package Grant 7,015,065 - Tsai , et al. March 21, 2 | 2006-03-21 |
| Multi-chip module with embedded package and method for manufacturing the same App 20050230799 - Kang, Jung-Kun | 2005-10-20 |
| Manufacturing method of ball grid array package App 20050090043 - Tsai, Yu-Fang ; et al. | 2005-04-28 |
| Stacked Chip-packaging Structure App 20050023657 - Tsai, Yu-Fang ; et al. | 2005-02-03 |
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