loadpatents
Patent applications and USPTO patent grants for Kang; Jung Eun.The latest application filed is for "hybrid heat-radiating substrate and method of manufacturing the same".
Patent | Date |
---|---|
Method of manufacturing a hybrid heat-radiating substrate Grant 9,107,313 - Lim , et al. August 11, 2 | 2015-08-11 |
Hybrid Heat-radiating Substrate And Method Of Manufacturing The Same App 20140096380 - LIM; Chang Hyun ;   et al. | 2014-04-10 |
Power Module Package App 20140084447 - Kang; Jung Eun ;   et al. | 2014-03-27 |
Power Module Package App 20130062744 - Kim; Kwang Soo ;   et al. | 2013-03-14 |
Heat-radiating Substrate And Method Of Manufacturing The Same App 20130042963 - Lim; Chang Hyun ;   et al. | 2013-02-21 |
Heat-radiating substrate and manufacturing method thereof Grant 8,338,714 - Kang , et al. December 25, 2 | 2012-12-25 |
Heat-radiating substrate and method of manufacturing the same Grant 8,315,056 - Lim , et al. November 20, 2 | 2012-11-20 |
Rigid-flexible circuit board and method of manufacturing the same Grant 8,198,543 - Kang , et al. June 12, 2 | 2012-06-12 |
Heat-radiating Substrate And Method For Manufacturing The Same App 20120111610 - KIM; Kwang Soo ;   et al. | 2012-05-10 |
Anodized Heat-radiating Substrate And Method Of Manufacturing The Same App 20120073863 - KANG; Jung Eun ;   et al. | 2012-03-29 |
Heat-radiating Substrate And Method For Manufacturing The Same App 20120067623 - PARK; Sung Keun ;   et al. | 2012-03-22 |
Printed Circuit Board And Method Of Manufacturing The Same App 20120000697 - Kang; Jung Eun ;   et al. | 2012-01-05 |
Hybrid Heat-radiating Substrate And Method Of Manufacturing The Same App 20110303440 - LIM; Chang Hyun ;   et al. | 2011-12-15 |
Heat-radiating Substrate And Method Of Manufacturing The Same App 20110304990 - Lim; Chang Hyun ;   et al. | 2011-12-15 |
Heat-radiating Substrate And Method Of Manufacturing The Same App 20110303437 - LIM; Chang Hyun ;   et al. | 2011-12-15 |
Heat-radiating Substrate And Manufacturing Method Thereof App 20110240346 - Kang; Jung Eun ;   et al. | 2011-10-06 |
Rigid-flexible Circuit Board And Method Of Manufacturing The Same App 20110075374 - KANG; Jung Eun ;   et al. | 2011-03-31 |
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