Kang; Hyuck-Jin

Patent Applications and Registrations

Patent applications and USPTO patent grants for Kang; Hyuck-Jin.The latest application filed is for "integrated circuit devices having corrosion resistant fuse regions and methods of fabricating the same".

Company Profile

0.4.6

Kang; Hyuck-Jin - Seoul KR
Kang, Hyuck-Jin - Seoul-City KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Fuse region of a semiconductor region Grant 7,352,050 - Kang , et al. April 1, 2	2008-04-01
Integrated circuit devices having corrosion resistant fuse regions and methods of fabricating the same App 20070114635 - Cho; Tai-Heui ; et al.	2007-05-24
Integrated circuit devices having corrosion resistant fuse regions and methods of fabricating the same Grant 7,180,154 - Cho , et al. February 20, 2	2007-02-20
Bonding pad structure of a semiconductor device Grant 6,984,895 - Cho , et al. January 10, 2	2006-01-10
Fuse region of a semiconductor device and method of fabricating the same App 20050212081 - Kang, Hyuck-Jin ; et al.	2005-09-29
Bonding pad structure of a semiconductor device and method for manufacturing the same Grant 6,867,070 - Cho , et al. March 15, 2	2005-03-15
Integrated circuit devices having corrosion resistant fuse regions and methods of fabricating the same App 20040262768 - Cho, Tai-Heui ; et al.	2004-12-30
Bonding pad structure of a semiconductor device and method for manufacturing the same App 20030136979 - Cho, Tai-Heui ; et al.	2003-07-24
Bonding pad structure of a semiconductor device and method for manufacturing the same App 20030094634 - Cho, Tai-Heui ; et al.	2003-05-22
Semiconductor device having a contact window and fabrication method thereof App 20030008453 - Kang, Hyuck-Jin ; et al.	2003-01-09

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