Kang; Hyo Soon

Patent Applications and Registrations

Patent applications and USPTO patent grants for Kang; Hyo Soon.The latest application filed is for "semiconductor device, a method for manufacturing the same, and a system having the same".

Company Profile

1.12.17

Kang; Hyo Soon - Seoul KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor device having a floating option pad, and a method for manufacturing the same Grant 10,403,331 - Chu , et al. Sep	2019-09-03
Semiconductor chip and a semiconductor package having a package on package (POP) structure including the semiconductor chip Grant 9,472,539 - Kim , et al. October 18, 2	2016-10-18
Stack semiconductor package Grant 9,466,593 - Lee , et al. October 11, 2	2016-10-11
Semiconductor Device, A Method For Manufacturing The Same, And A System Having The Same App 20160293230 - Chu; Yong Gyu ; et al.	2016-10-06
Semiconductor device including option pads for determining an operating structure thereof, and a system having the same Grant 9,390,772 - Chu , et al. July 12, 2	2016-07-12
Stack Semiconductor Package App 20160190109 - Lee; Dae-Ho ; et al.	2016-06-30
Semiconductor memory chips and stack-type semiconductor packages including the same Grant 9,355,976 - Kim , et al. May 31, 2	2016-05-31
Printed circuit board having traces and ball grid array package including the same Grant 9,355,947 - Kang , et al. May 31, 2	2016-05-31
Semiconductor Chip And A Semiconductor Package Having A Package On Package (pop) Structure Including The Semiconductor Chip App 20160126229 - Kim; Yong-Hoon ; et al.	2016-05-05
Semiconductor Package App 20160013158 - KANG; Hyo-Soon ; et al.	2016-01-14
Printed Circuit Board Having Traces And Ball Grid Array Package Including The Same App 20150332993 - KANG; Hyo-soon ; et al.	2015-11-19
Package-on-package device Grant 9,105,503 - Kim , et al. August 11, 2	2015-08-11
Semiconductor Chip And A Semiconductor Package Having A Package On Package (pop) Structure Including The Semiconductor Chip App 20140319701 - Kim; Yong-hoon ; et al.	2014-10-30
Package-on-package Device App 20140217586 - KIM; Yonghoon ; et al.	2014-08-07
Semiconductor package with package on package structure Grant 8,791,559 - Kim , et al. July 29, 2	2014-07-29
Semiconductor Memory Chips And Stack-type Semiconductor Packages Including The Same App 20140138851 - KIM; YONGHOON ; et al.	2014-05-22
Semiconductor Device, A Method For Manufacturing The Same, And A System Having The Same App 20130315004 - Chu; Yong Gyu ; et al.	2013-11-28
Semiconductor Package With Package On Package Structure App 20130168871 - KIM; Yong-hoon ; et al.	2013-07-04

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