Kang; Hyeongmun
Patent Applications and Registrations
Patent applications and USPTO patent grants for Kang; Hyeongmun.The latest application filed is for "semiconductor package including a dummy chip".
- Kang; Hyeongmun - Hwaseong-si KR
- Kang; Hyeongmun - Seoul KR
| Patent | Date |
|---|---|
| Semiconductor Package Including A Dummy Chip App 20220278010 - Kang; Hyeongmun ; et al. | 2022-09-01 |
| Semiconductor Package Including Test Bumps App 20220148994 - KIM; Taehyeong ; et al. | 2022-05-12 |
| Semiconductor Package And Method Of Manufacturing The Same App 20220139881 - SONG; Hyeonjun ; et al. | 2022-05-05 |
| Semiconductor package including test bumps Grant 11,257,725 - Kim , et al. February 22, 2 | 2022-02-22 |
| Semiconductor package and method of manufacturing the same Grant 11,257,794 - Song , et al. February 22, 2 | 2022-02-22 |
| Chip-stacked Semiconductor Package With Increased Package Reliability App 20210398947 - SHIN; Insup ; et al. | 2021-12-23 |
| Semiconductor Package And Method Of Manufacturing The Same App 20210265315 - SONG; Hyeonjun ; et al. | 2021-08-26 |
| Semiconductor Package And Method Of Manufacturing The Same App 20210210397 - KANG; HYEONGMUN ; et al. | 2021-07-08 |
| Semiconductor Package Including Test Bumps App 20210175134 - KIM; Taehyeong ; et al. | 2021-06-10 |
| Semiconductor Package App 20210143008 - Ko; Jungmin ; et al. | 2021-05-13 |
| Semiconductor package and method of fabricating the same Grant 9,035,308 - Yim , et al. May 19, 2 | 2015-05-19 |
| Semiconductor Package And Method Of Fabricating The Same App 20140374883 - YIM; CHOONGBIN ; et al. | 2014-12-25 |
| Package Substrate Structure And Semiconductor Package Including The Same App 20140103517 - PARK; Sung-Kyu ; et al. | 2014-04-17 |
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