KANG; Gil Man
Patent Applications and Registrations
Patent applications and USPTO patent grants for KANG; Gil Man.The latest application filed is for "chip bonding apparatus, a system for replacing bonding tool assembly, and a method for fabricating a semiconductor device using the chip bonding apparatus".
- KANG; Gil Man - Suwon-si KR
- Kang; Gil-Man - Cheonan-si KR
| Patent | Date |
|---|---|
| Chip Bonding Apparatus, A System For Replacing Bonding Tool Assembly, And A Method For Fabricating A Semiconductor Device Using The Chip Bonding Apparatus App 20200312811 - KIM; Jae-Cheol ; et al. | 2020-10-01 |
| Apparatus for correcting a parallelism between a bonding head and a stage, and a chip bonder including the same Grant 10,692,833 - Kim , et al. | 2020-06-23 |
| Apparatus For Correcting A Parallelism Between A Bonding Head And A Stage, And A Chip Bonder Including The Same App 20180102340 - KIM; Jae-Cheol ; et al. | 2018-04-12 |
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