Kang; Chun-Wei
Patent Applications and Registrations
Patent applications and USPTO patent grants for Kang; Chun-Wei.The latest application filed is for "integrated circuit package and die".
- Kang; Chun-Wei - Hsinchu TW
- Kang; Chun-Wei - Hsinchu City TW
- KANG; Chun-Wei - Kaohsiung City TW
- Kang; Chun-Wei - Kaohsiung TW
| Patent | Date |
|---|---|
| Driver circuit and a display apparatus Grant 11,282,438 - Kang , et al. March 22, 2 | 2022-03-22 |
| Integrated circuit package and die Grant 11,244,891 - Cheng , et al. February 8, 2 | 2022-02-08 |
| Integrated Circuit Package And Die App 20220028775 - Cheng; Jhih-Siou ; et al. | 2022-01-27 |
| Driving system, sensing method and driving circuit for touch display device Grant 11,188,171 - Liang , et al. November 30, 2 | 2021-11-30 |
| Driver Circuit And A Display Apparatus App 20210304661 - Kang; Chun-Wei ; et al. | 2021-09-30 |
| Metal-insulator-metal Capacitor And Method For Fabricating The Same App 20210288138 - HUANG; Bo-Wei ; et al. | 2021-09-16 |
| Driving System, Sensing Method And Driving Circuit For Touch Display Device App 20210072859 - Liang; Keko-Chun ; et al. | 2021-03-11 |
| Wrist joint performance measuring device Grant 9,757,064 - Hsiao , et al. September 12, 2 | 2017-09-12 |
| Wrist Joint Performance Measuring Device App 20170000408 - Hsiao; Chih-Kun ; et al. | 2017-01-05 |
| Method for forming semiconductor structure having through silicon via for signal and shielding structure Grant 8,916,471 - Yang , et al. December 23, 2 | 2014-12-23 |
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