Kang; Byoung-young

Patent Applications and Registrations

Patent applications and USPTO patent grants for Kang; Byoung-young.The latest application filed is for "image sensor chip package and method of fabricating the same".

Company Profile

0.7.7

Kang; Byoung-young - Seongnam-si KR
Kang; Byoung Young - Icheon-si KR
Kang; Byoung Young - Seoul KR
Kang; Byoung Young - Icheon KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Chip package for image sensor and method of manufacturing the same Grant 7,701,044 - Kang , et al. April 20, 2	2010-04-20
Image sensor chip package and method of fabricating the same Grant 7,510,902 - Kang March 31, 2	2009-03-31
Image Sensor Chip Package and Method of Fabricating the Same App 20080188030 - KANG; Byoung Young	2008-08-07
Image sensor chip package and method of fabricating the same Grant 7,372,122 - Kang May 13, 2	2008-05-13
Chip package for image sensor and method of manufacturing the same App 20080093721 - Kang; Byoung-young ; et al.	2008-04-24
Method for packaging a semiconductor device Grant 7,229,849 - Kang June 12, 2	2007-06-12
Semiconductor chip packages and methods for fabricating the same Grant 7,119,001 - Kang October 10, 2	2006-10-10
Image sensor chip package and method of fabricating the same App 20060091488 - Kang; Byoung Young	2006-05-04
Semiconductor chip packages and methods for fabricating the same App 20060046348 - Kang; Byoung Young	2006-03-02
Method for packaging a semiconductor device Grant 6,953,710 - Kang October 11, 2	2005-10-11
Ceramic packaging method employing flip-chip bonding Grant 6,836,961 - Kang January 4, 2	2005-01-04
Ceramic packaging method employing flip-chip bonding App 20040154164 - Kang, Byoung Young	2004-08-12
Method for packaging a semiconductor device App 20040157371 - Kang, Byoung Young	2004-08-12
Method for packaging a semiconductor device App 20040157366 - Kang, Byoung Young	2004-08-12

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