Kang; Byoung-Un

Patent Applications and Registrations

Patent applications and USPTO patent grants for Kang; Byoung-Un.The latest application filed is for "multifunctional die attachment film and semiconductor packaging using the same".

Company Profile

0.6.13

Kang; Byoung-Un - Seoul KR
Kang; Byoung-Un - Yongin-si KR
Kang; Byoung-Un - Gyeonggi-do KR
Kang; Byoung Un - Uiwang-si KR
Kang; Byoung-Un - Kyunggi-do KR
Kang, Byoung-Un - Uiwang KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Multifunctional Die Attachment Film And Semiconductor Packaging Using The Same App 20100317155 - Kang; Byoung-Un ; et al.	2010-12-16
Dicing die attachment film and method for packaging semiconductor using same Grant 7,768,141 - Seo , et al. August 3, 2	2010-08-03
Method For Packaging Semiconductor App 20100087067 - Seo; Joon-Mo ; et al.	2010-04-08
Adhesive Film For Semiconductor App 20090198013 - Shin; Dong-Cheon ; et al.	2009-08-06
Semiconductor packaging method Grant 7,553,701 - Seo , et al. June 30, 2	2009-06-30
Dicing Die Attachment Film And Method For Packaging Semiconductor Using Same App 20090091044 - Seo; Joon-Mo ; et al.	2009-04-09
Attach Paste Composition For Semiconductor Package App 20090088527 - Seo; Joon-Mo ; et al.	2009-04-02
Semiconductor Packaging Method App 20090053857 - Seo; Joon-Mo ; et al.	2009-02-26
Dicing die adhesive film for semiconductor Grant 7,485,494 - Kang , et al. February 3, 2	2009-02-03
Reacting functionalized trialkoxysilane with polyepoxide or diamine to yield silane adduct Grant 7,408,015 - Kang , et al. August 5, 2	2008-08-05
Die-attaching paste composition and method for hardening the same App 20070134847 - Kang; Byoung-Un ; et al.	2007-06-14
Dual printing mask for screen printing App 20070101877 - Seo; Joon-Mo ; et al.	2007-05-10
Dicing die adhesive film for semiconductor App 20060244132 - Kang; Byoung-Un ; et al.	2006-11-02
Silane adduct, manufacturing thereof and method for coupling organic die attach adhesive and inorganic materials using the same Grant 7,105,625 - Kang , et al. September 12, 2	2006-09-12
Silane adduct, manufacturing thereof and method for coupling organic die attach adhesive and inorganic materials using the same App 20060094848 - Kang; Byoung Un ; et al.	2006-05-04
Flexible metal clad laminate film and a manufacturing method for the same App 20050266249 - Shin, Dongcheon ; et al.	2005-12-01
Surface treatment method of copper foil with silane coupling agent Grant 6,878,261 - Kim , et al. April 12, 2	2005-04-12
Silane adduct, manufacturing thereof and method for coupling organic die attach adhesive and inorganic materials using the same App 20040216840 - Kang, Byoung Un ; et al.	2004-11-04
Surface treatment method of copper foil with silane coupling agent App 20030111351 - Kim, Sang-Kyum ; et al.	2003-06-19

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