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Patent applications and USPTO patent grants for Kanezaki; Saori.The latest application filed is for "suspension board with circuit and producing method thereof".
Patent | Date |
---|---|
Wired circuit board and producing method thereof Grant 10,080,279 - Okuno , et al. September 18, 2 | 2018-09-18 |
Suspension board with circuit Grant 9,865,288 - Terada , et al. January 9, 2 | 2018-01-09 |
Suspension board with circuit and producing method thereof Grant 9,521,745 - Fujimura , et al. December 13, 2 | 2016-12-13 |
Suspension board with circuit Grant 9,502,058 - Fujimura , et al. November 22, 2 | 2016-11-22 |
Suspension Board With Circuit And Producing Method Thereof App 20160270216 - FUJIMURA; Yoshito ;   et al. | 2016-09-15 |
Suspension Board With Circuit App 20160239055 - TERADA; Naohiro ;   et al. | 2016-08-18 |
Suspension board with circuit Grant 9,418,687 - Terada , et al. August 16, 2 | 2016-08-16 |
Suspension Board With Circuit App 20160133284 - TERADA; Naohiro ;   et al. | 2016-05-12 |
Wired circuit board Grant 9,338,888 - Kanezaki , et al. May 10, 2 | 2016-05-10 |
Suspension Board With Circuit App 20160111115 - FUJIMURA; Yoshito ;   et al. | 2016-04-21 |
Wired Circuit Board And Producing Method Thereof App 20150382453 - OKUNO; Tomoaki ;   et al. | 2015-12-31 |
Method of producing a wired circuit board Grant 9,167,693 - Okuno , et al. October 20, 2 | 2015-10-20 |
Wired circuit board including an insulating layer formed with an opening filled with a conductive portion and producing method thereof Grant 9,018,540 - Ishii , et al. April 28, 2 | 2015-04-28 |
Wired Circuit Board And Producing Method Thereof App 20140144680 - OKUNO; Tomoaki ;   et al. | 2014-05-29 |
Wired Circuit Board And Producing Method Thereof App 20130319748 - ISHII; Jun ;   et al. | 2013-12-05 |
Wired Circuit Board App 20130248233 - KANEZAKI; Saori ;   et al. | 2013-09-26 |
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