Kaneko; Yuhei
Patent Applications and Registrations
Patent applications and USPTO patent grants for Kaneko; Yuhei.The latest application filed is for "three-dimensional powder bed fusion additive manufacturing apparatus and three-dimensional powder bed fusion additive manufacturing method".
- Kaneko; Yuhei - Tokyo JP
| Patent | Date |
|---|---|
| Three-Dimensional Powder Bed Fusion Additive Manufacturing Apparatus and Three-Dimensional Powder Bed Fusion Additive Manufacturing Method App 20220297193 - Kawakami; Masahiko ; et al. | 2022-09-22 |
| Semiconductor device and method for adjusting impedance of output circuit Grant 9,614,497 - Kaneko , et al. April 4, 2 | 2017-04-04 |
| Semiconductor Device And Method For Adjusting Impedance Of Output Circuit App 20160164494 - KANEKO; YUHEI ; et al. | 2016-06-09 |
| Semiconductor device and method for adjusting impedance of output circuit Grant 9,294,072 - Kaneko , et al. March 22, 2 | 2016-03-22 |
| Semiconductor Device And Method For Adjusting Impedance Of Output Circuit App 20150022282 - Kaneko; Yuhei ; et al. | 2015-01-22 |
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