Kaneko; Hisashi

Patent Applications and Registrations

Patent applications and USPTO patent grants for Kaneko; Hisashi.The latest application filed is for "method for generating pattern, method for manufacturing semiconductor device, semiconductor device, and computer program".

Company Profile

0.78.69

Kaneko; Hisashi - Fujisawa N/A JP
Kaneko; Hisashi - Kanagawa JP
Kaneko; Hisashi - Fujisawa-shi JP
Kaneko; Hisashi - Kawasaki JP
KANEKO; Hisashi - Kanagawa-ken JP
Kaneko; Hisashi - Tokyo JA
Kaneko; Hisashi - Tokyo-to JA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Reliability evaluation test apparatus, reliability evaluation test system, contactor, and reliability evaluation test method Grant 8,456,186 - Takekoshi , et al. June 4, 2	2013-06-04
Method of manufacturing a semiconductor device from which damage layers and native oxide films in connection holes have been removed Grant 8,232,197 - Honda , et al. July 31, 2	2012-07-31
Method for generating pattern, method for manufacturing semiconductor device, semiconductor device, and computer program Grant 7,996,813 - Hatano , et al. August 9, 2	2011-08-09
Stress analysis method, wiring structure design method, program, and semiconductor device production method Grant 7,921,401 - Ito , et al. April 5, 2	2011-04-05
Method for generating pattern, method for manufacturing semiconductor device, semiconductor device, and computer program App 20100115479 - Hatano; Masaaki ; et al.	2010-05-06
Semiconductor device including an insulating film and insulating pillars and manufacturing method of the semiconductor device Grant 7,675,183 - Toyoda , et al. March 9, 2	2010-03-09
Method for generating pattern, method for manufacturing semiconductor device, semiconductor device, and computer program product Grant 7,667,332 - Hatano , et al. February 23, 2	2010-02-23
Method of manufacturing a semiconductor device from which damage layers and native oxide films in connection holes have been removed App 20100003816 - Honda; Makoto ; et al.	2010-01-07
Method for fabricating semiconductor device Grant 7,635,646 - Omoto , et al. December 22, 2	2009-12-22
Carriage Assembly And Disk Drive App 20090290261 - Kaneko; Hisashi ; et al.	2009-11-26
Method for fabricating semiconductor device Grant 7,608,537 - Matsuo , et al. October 27, 2	2009-10-27
Method of manufacturing a semiconductor device from which damage layers and native oxide films in connection holes have been removed Grant 7,605,076 - Honda , et al. October 20, 2	2009-10-20
Interconnect metallization method having thermally treated copper plate film with reduced micro-voids Grant 7,601,638 - Hasunuma , et al. October 13, 2	2009-10-13
Plating method Grant 7,575,664 - Matsuda , et al. August 18, 2	2009-08-18
Recording disk drive having shroud Grant 7,554,762 - Suwa , et al. June 30, 2	2009-06-30
Manufacturing Method For Semiconductor Device And Manufacturing Apparatus For Semiconductor Device App 20090156002 - Fujita; Keiji ; et al.	2009-06-18
Semiconductor device having power semiconductor elements Grant 7,531,876 - Omura , et al. May 12, 2	2009-05-12
Method for manufacturing a semiconductor device Grant 7,521,352 - Shinomiya , et al. April 21, 2	2009-04-21
Storage Device App 20090067086 - Kaneko; Hisashi ; et al.	2009-03-12
Recording disk drive capable of suppressing vibration of flexible printed circuit board Grant 7,495,866 - Izumi , et al. February 24, 2	2009-02-24
Plating Apparatus App 20080296165 - KUNISAWA; Junji ; et al.	2008-12-04
Method For Fabricating Semiconductor Device App 20080299766 - OMOTO; Seiichi ; et al.	2008-12-04
Recording disk drive capable of suppressing vibration of flexible printed circuit board Grant 7,453,046 - Izumi , et al. November 18, 2	2008-11-18
Plating Apparatus App 20080251385 - Kunisawa; Junji ; et al.	2008-10-16
Semiconductor device and manufacturing method of semiconductor device App 20080237863 - Toyoda; Hiroshi ; et al.	2008-10-02
Magnetic head actuator with centered deviation Grant 7,414,815 - Fujimoto , et al. August 19, 2	2008-08-19
Method of performing electrolytic treatment on a conductive layer of a substrate Grant 7,387,717 - Kunisawa , et al. June 17, 2	2008-06-17
Method For Manufacturing Semiconductor Device App 20080102628 - Hasunuma; Masahiko ; et al.	2008-05-01
Method for Fabricating Semiconductor Device App 20080081466 - MATSUO; Mie ; et al.	2008-04-03
Magnetic head actuator with equalized deviation Grant 7,336,448 - Fujimoto , et al. February 26, 2	2008-02-26
Disk apparatus App 20080037176 - Matsuda; Yoshiharu ; et al.	2008-02-14
Reliability Evaluation Test Apparatus, Reliability Evaluation Test System, Contactor, And Reliability Evaluation Test Method App 20080018355 - TAKEKOSHI; Kiyoshi ; et al.	2008-01-24
Method of manufacturing semiconductor device Grant 7,314,827 - Toyoda , et al. January 1, 2	2008-01-01
Simulation circuit pattern evaluation method, manufacturing method of semiconductor integrated circuit, test substrate, and test substrate group Grant 7,308,395 - Kaneko , et al. December 11, 2	2007-12-11
Method for manufacturing a semiconductor device App 20070254474 - Shinomiya; Hideo ; et al.	2007-11-01
Magnetic disk device App 20070253114 - Fujimoto; Shinji ; et al.	2007-11-01
Stress analysis method, wiring structure design method, program, and semiconductor device production method App 20070204243 - Ito; Sachiyo ; et al.	2007-08-30
Reliability evaluation test apparatus, reliability evaluation test system, contactor, and reliability evaluation test method Grant 7,242,206 - Takekoshi , et al. July 10, 2	2007-07-10
Recording disk drive capable of suppressing vibration of flexible printed circuit board App 20070153426 - Izumi; Mitsuhiro ; et al.	2007-07-05
Recording disk drive capable of suppressing vibration of flexible printed circuit board App 20070153427 - Izumi; Mitsuhiro ; et al.	2007-07-05
Heating element movement bonding method for semiconductor components Grant 7,238,919 - Kaneko , et al. July 3, 2	2007-07-03
Method of manufacturing semiconductor device Grant 7,232,763 - Omura , et al. June 19, 2	2007-06-19
Method of manufacturing electronic device Grant 7,214,305 - Matsuda , et al. May 8, 2	2007-05-08
Method of producing semiconductor device Grant 7,202,168 - Ikenoue , et al. April 10, 2	2007-04-10
Magnetic disc apparatus App 20070002495 - Nagata; Hiroshi ; et al.	2007-01-04
Recording disk drive having shroud App 20070002490 - Suwa; Masaya ; et al.	2007-01-04
Bonding method and bonding apparatus App 20060207985 - Kaneko; Hisashi ; et al.	2006-09-21
Method of manufacturing a semiconductor device from which damage layers and native oxide films in connection holes have been removed App 20060189145 - Honda; Makoto ; et al.	2006-08-24
Reliability evaluation test apparatus, reliability evaluation test system, contactor, and reliability evaluation test method Grant 7,091,733 - Takekoshi , et al. August 15, 2	2006-08-15
Semiconductor device and manufacturing method of semiconductor device App 20060113674 - Toyoda; Hiroshi ; et al.	2006-06-01
Wafer support plate, holding method of thin wafer, and manufacturing method of semiconductor device App 20060102290 - Harada; Susumu ; et al.	2006-05-18
Method for generating pattern, method for manufacturing semiconductor device, semiconductor device, and computer program product App 20060097399 - Hatano; Masaaki ; et al.	2006-05-11
Semiconductor device and method of manufacturing semiconductor device App 20060071271 - Omura; Ichiro ; et al.	2006-04-06
Method of manufacturing semiconductor device App 20060068600 - Toyoda; Hiroshi ; et al.	2006-03-30
Semiconductor device and manufacturing method thereof App 20060055050 - Numata; Hideo ; et al.	2006-03-16
Electronic device manufacturing method Grant 6,998,342 - Matsuda , et al. February 14, 2	2006-02-14
Method of producing semiconductor device App 20060024952 - Ikenoue; Hiroshi ; et al.	2006-02-02
Flexible printed circuit board unit contributing to reliable soldering and suppression of increased temperature Grant 6,992,864 - Kaneko , et al. January 31, 2	2006-01-31
Reliability evaluation test apparatus, reliability evaluation test system, contactor, and reliability evaluation test method App 20050253575 - Takekoshi, Kiyoshi ; et al.	2005-11-17
Substrate processing apparatus and substrate processing method App 20050241955 - Mishima, Koji ; et al.	2005-11-03
Plating method App 20050211560 - Matsuda, Tetsuo ; et al.	2005-09-29
Semiconductor device and method for manufacturing the same Grant 6,946,387 - Wada , et al. September 20, 2	2005-09-20
Magnetic disk device App 20050190505 - Fujimoto, Shinji ; et al.	2005-09-01
Magnetic disk apparatus App 20050190504 - Funabashi, Kei ; et al.	2005-09-01
Recording disk drive capable of suppressing vibration of flexible printed circuit board App 20050190489 - Izumi, Mitsuhiro ; et al.	2005-09-01
Plating method and plating apparatus Grant 6,913,681 - Matsuda , et al. July 5, 2	2005-07-05
Method of manufacturing semiconductor device including two-step polishing operation for cap metal Grant 6,897,143 - Toyoda , et al. May 24, 2	2005-05-24
Method of manufacturing semiconductor device App 20050106866 - Omura, Mitsuhiro ; et al.	2005-05-19
Simulation circuit pattern evaluation method, manufacturing method of semiconductor integrated circuit, test substrate, and test substrate group App 20050075854 - Kaneko, Hisashi ; et al.	2005-04-07
Semiconductor device and method of manufacturing the same App 20040251550 - Yoda, Takashi ; et al.	2004-12-16
Semiconductor integrated circuit device having multilevel interconnection App 20040245645 - Miyamoto, Koji ; et al.	2004-12-09
Method of manufacturing electronic device App 20040226827 - Matsuda, Tetsuo ; et al.	2004-11-18
Electronic device manufacturing method App 20040203221 - Matsuda, Tetsuo ; et al.	2004-10-14
Plating method and plating apparatus App 20040195106 - Mishima, Koji ; et al.	2004-10-07
Reliability evaluation test apparatus, reliability evaluation test system, contactor, and reliability evaluation test method App 20040183561 - Takekoshi, Kiyoshi ; et al.	2004-09-23
Flexible Printed Circuit Board Unit Contributing To Reliable Soldering And Suppression Of Increased Temperature App 20040179306 - KANEKO, Hisashi ; et al.	2004-09-16
Semiconductor device and manufacturing method of semiconductor device App 20040159951 - Toyoda, Hiroshi ; et al.	2004-08-19
Semiconductor integrated circuit device having multilevel interconnection Grant 6,774,024 - Miyamoto , et al. August 10, 2	2004-08-10
Electroplating apparatus and electroplating method Grant 6,767,437 - Matsuda , et al. July 27, 2	2004-07-27
Electronic device manufacturing method Grant 6,764,585 - Matsuda , et al. July 20, 2	2004-07-20
Plating method and plating apparatus Grant 6,746,589 - Mishima , et al. June 8, 2	2004-06-08
Semiconductor Integrated Circuit Device Having Multilevel Interconnection App 20040104482 - Miyamoto, Koji ; et al.	2004-06-03
Semiconductor device with improved bonding Grant 6,727,593 - Toyoda , et al. April 27, 2	2004-04-27
Plating apparatus App 20040069646 - Kunisawa, Junji ; et al.	2004-04-15
Method and apparatus for plating substrate with copper App 20040050711 - Mishima, Koji ; et al.	2004-03-18
Semiconductor device and method for manufacturing the same App 20040043602 - Wada, Junichi ; et al.	2004-03-04
Semiconductor Integrated Circuit Device Having Multilevel Interconnection App 20040012091 - Miyamoto, Koji ; et al.	2004-01-22
Disk drive device Grant 6,678,112 - Kaneko January 13, 2	2004-01-13
Method of manufacturing semiconductor device and semiconductor device App 20040005774 - Toyoda, Hiroshi ; et al.	2004-01-08
Semiconductor device and method of manufacturing the same Grant 6,673,704 - Wada , et al. January 6, 2	2004-01-06
Semiconductor integrated circuit device having multilevel interconnection Grant 6,670,714 - Miyamoto , et al. December 30, 2	2003-12-30
Semiconductor device and method of manufacturing the same App 20030214010 - Toyoda, Hiroshi ; et al.	2003-11-20
Method and apparatus for plating substrate with copper Grant 6,638,411 - Mishima , et al. October 28, 2	2003-10-28
Plating apparatus Grant 6,632,335 - Kunisawa , et al. October 14, 2	2003-10-14
Substrate processing method and substrate processing apparatus Grant 6,632,476 - Nakamura , et al. October 14, 2	2003-10-14
Method of and apparatus for controlling disk drive Grant 6,633,450 - Kaneko October 14, 2	2003-10-14
Semiconductor device having a damascene type wiring layer Grant 6,611,060 - Toyoda , et al. August 26, 2	2003-08-26
Eddy current loss measuring sensor, thickness measuring system, thickness measuring method, and recorded medium Grant 6,563,308 - Nagano , et al. May 13, 2	2003-05-13
Eddy Current Loss Measuring Sensor, Thickness Measuring System, Thickness Measuring Method, And Recorded Medium App 20030067298 - Nagano, Osamu ; et al.	2003-04-10
Electroless plating solution and method of forming wiring with the same App 20030024431 - Inoue, Hiroaki ; et al.	2003-02-06
Semiconductor device and method for manufacturing the same App 20020192938 - Wada, Junichi ; et al.	2002-12-19
Semiconductor device and manufacturing method thereof App 20020130415 - Hasunuma, Masahiko ; et al.	2002-09-19
Semiconductor device and manufacturing method of semiconductor device App 20020121703 - Toyoda, Hiroshi ; et al.	2002-09-05
Semiconductor device and method for manufacturing the same Grant 6,440,843 - Wada , et al. August 27, 2	2002-08-27
Plating method and plating apparatus App 20020096435 - Matsuda, Tetsuo ; et al.	2002-07-25
Film formation method Grant 6,403,481 - Matsuda , et al. June 11, 2	2002-06-11
Plating method and plating apparatus App 20020056647 - Mishima, Koji ; et al.	2002-05-16
Electronic device manufacturing method App 20020050459 - Matsuda, Tetsuo ; et al.	2002-05-02
Method For Manufacturing Semiconductor Device Having Low Dielectric Constant Insulating Film, Wafer Processing Equipment And Wafer Storing Box Used In This Method App 20020037655 - Hasunuma, Masahiko ; et al.	2002-03-28
Plating apparatus and plating method for substrate App 20020033339 - Kimura, Norio ; et al.	2002-03-21
Plating apparatus and plating method for substrate App 20020020627 - Kunisawa, Junji ; et al.	2002-02-21
Method of manufacturing a copper interconnect Grant 6,348,402 - Kawanoue , et al. February 19, 2	2002-02-19
Method of forming diffusion barrier for copper interconnects Grant 6,342,444 - Higashi , et al. January 29, 2	2002-01-29
Semiconductor device having multilevel interconnection App 20020003304 - Matsunaga, Noriaki ; et al.	2002-01-10
Electroplating apparatus and electroplating method App 20020000379 - Matsuda, Tetsuo ; et al.	2002-01-03
Semiconductor device manufacturing method and semiconductor device App 20010038147 - Higashi, Kazuyuki ; et al.	2001-11-08
Substrate processing method and substrate processing apparatus App 20010033894 - Nakamura, Hiroko ; et al.	2001-10-25
Method for production of semiconductor device Grant 6,306,756 - Hasunuma , et al. October 23, 2	2001-10-23
Semiconductor substrate processing apparatus and method App 20010024691 - Kimura, Norio ; et al.	2001-09-27
Semiconductor device manufacturing method and semiconductor device Grant 6,291,891 - Higashi , et al. September 18, 2	2001-09-18
Semiconductor device and method of manufacturing the same App 20010013617 - Toyoda, Hiroshi ; et al.	2001-08-16
Semiconductor device and method of manufacturing the same Grant 6,229,211 - Kawanoue , et al. May 8, 2	2001-05-08
Method for forming barrier layer for copper metallization Grant 6,150,270 - Matsuda , et al. November 21, 2	2000-11-21
Method of manufacturing semiconductor device Grant 6,110,647 - Inoue , et al. August 29, 2	2000-08-29
Method for production of semiconductor device Grant 6,090,701 - Hasunuma , et al. July 18, 2	2000-07-18
Method of filling contact holes and wiring grooves of a semiconductor device Grant 6,071,810 - Wada , et al. June 6, 2	2000-06-06
Electric solid state device and method for manufacturing the device Grant 6,054,770 - Toyoda , et al. April 25, 2	2000-04-25
Method of manufacturing semiconductor device Grant 5,953,634 - Kajita , et al. September 14, 1	1999-09-14
Magnetic disk drive and flexible printed board used in such drive Grant 5,859,746 - Ishida , et al. January 12, 1	1999-01-12
Apparatus for absorbing stator vibrations in computer storage apparatus Grant 5,798,887 - Yoshida , et al. August 25, 1	1998-08-25
Polishing agent and polishing method using the same Grant 5,770,095 - Sasaki , et al. June 23, 1	1998-06-23
Electronic parts Grant 5,709,958 - Toyoda , et al. January 20, 1	1998-01-20
Magnetic disk apparatus Grant 5,673,159 - Jinbo , et al. September 30, 1	1997-09-30
Polishing pad, polishing apparatus and polishing method Grant 5,664,989 - Nakata , et al. September 9, 1	1997-09-09
Semiconductor device having a single-crystal metal wiring Grant 5,661,345 - Wada , et al. August 26, 1	1997-08-26
Method of manufacture of semiconductor device Grant 5,629,236 - Wada , et al. May 13, 1	1997-05-13
Breather filter unit for magnetic disk drive Grant 5,590,001 - Ino , et al. December 31, 1	1996-12-31
Semiconductor device and method of manufacturing such semiconductor device Grant 5,498,909 - Hasunuma , et al. March 12, 1	1996-03-12
Method for making aluminum single crystal interconnections on insulators Grant 5,409,862 - Wada , et al. April 25, 1	1995-04-25
Circuits And Methods For Processing Delta-modulated Signals Grant 3,793,513 - Kaneko February 19, 1	1974-02-19
Converter For Segment Companded Pcm Codes Grant 3,766,546 - Aaron , et al. October 16, 1	1973-10-16
Bipolar Analog-to-digital Converter With Double Detection Of The Sign Bit Grant 3,735,392 - Kaneko May 22, 1	1973-05-22
Multilevel Code Conversion System Grant 3,697,874 - Kaneko October 10, 1	1972-10-10
Pcm Transmission System Employing Pulse Regenerators Grant 3,593,140 - Kaneko July 13, 1	1971-07-13
Multilevel Signal Transmission System Grant 3,571,725 - Kaneko , et al. March 23, 1	1971-03-23
Phase-locked Pulse Generator With Frequency Maintaining Function Grant 3,567,959 - Kaneko , et al. March 2, 1	1971-03-02

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