Kaneda; Yutaka

Patent Applications and Registrations

Patent applications and USPTO patent grants for Kaneda; Yutaka.The latest application filed is for "uncured laminate, reinforcing fiber composite material, method for producing uncured laminate, and method for producing reinforcing fiber composite material".

Company Profile

0.21.20

Kaneda; Yutaka - Osaka JP
Kaneda; Yutaka - Kanagawa JP
Kaneda; Yutaka - Settsu N/A JP
KANEDA; Yutaka - Settsu-shi JP
Kaneda; Yutaka - Kanuma JP
Kaneda; Yutaka - Tochigi JP
Kaneda; Yutaka - Kanuma-shi JP
Kaneda; Yutaka - Tokyo JP
Kaneda; Yutaka - Tokorozawa JP
Kaneda; Yutaka - Tanashi JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Uncured Laminate, Reinforcing Fiber Composite Material, Method For Producing Uncured Laminate, And Method For Producing Reinforcing Fiber Composite Material App 20210221113 - Furukawa; Yoshio ; et al.	2021-07-22
Injection Molded Body Of Polypropylene Resin Composition App 20180305535 - Matsumoto; Takashi ; et al.	2018-10-25
Automatic Transmission Control Device App 20150375750 - Toyota; Ryohey ; et al.	2015-12-31
Flame retardant, production method therefor, and flame retardant thermoplastic resin composition comprising the same Grant 8,580,903 - Taketani , et al. November 12, 2	2013-11-12
Resin Composition And Molded Product Thereof App 20130183536 - KANEDA; Yutaka ; et al.	2013-07-18
Rubber Modified Acrylic Resin Composition Excellent In Jet-blackness And Molded Product Thereof App 20130184375 - Aoyama; Taizo ; et al.	2013-07-18
Flame Retardant, Production Method Therefor, And Flame Retardant Thermoplastic Resin Composition Comprising The Same App 20120157632 - Taketani; Shuji ; et al.	2012-06-21
Method for manufacturing a bump-attached wiring circuit board Grant 7,520,053 - Kaneda , et al. April 21, 2	2009-04-21
Block copolymer Grant 7,407,694 - Taniguchi , et al. August 5, 2	2008-08-05
Acrylic block copolymer and thermoplastic resin composition Grant 7,309,736 - Taniguchi , et al. December 18, 2	2007-12-18
Mask for exposure App 20070169958 - Kaneda; Yutaka	2007-07-26
Method for manufacturing a multilayer flexible wiring board App 20070163111 - Kaneda; Yutaka	2007-07-19
Processes for manufacturing multilayer flexible wiring boards Grant 7,211,735 - Kaneda May 1, 2	2007-05-01
Wiring circuit board having bumps and method of producing same Grant 7,076,868 - Kaneda July 18, 2	2006-07-18
Method for manufacturing a bump-attached wiring circuit board App 20060070978 - Kaneda; Yutaka ; et al.	2006-04-06
Method for manufacturing a bump-attached wiring circuit board Grant 7,020,961 - Kaneda , et al. April 4, 2	2006-04-04
Method for manufacturing wiring circuit boards with bumps and method for forming bumps Grant 6,977,349 - Kaneda , et al. December 20, 2	2005-12-20
Block copolymer App 20050272865 - Taniguchi, Akio ; et al.	2005-12-08
Acrylic block copolymer and thermoplastic resin composition App 20050234199 - Taniguchi, Akio ; et al.	2005-10-20
Flexible printed wiring boards Grant 6,930,390 - Kaneda , et al. August 16, 2	2005-08-16
Wiring circuit board having bumps and method of producing same Grant 6,800,816 - Kaneda October 5, 2	2004-10-05
Wiring circuit board having bumps and method of producing same App 20040188139 - Kaneda, Yutaka	2004-09-30
Method for manufacturing wiring circuit boards with bumps and method for forming bumps App 20030201242 - Kaneda, Yutaka ; et al.	2003-10-30
Flexible wiring boards and manufacturing processes thereof App 20030116350 - Kaneda, Yutaka	2003-06-26
Method and apparatus for multi-channel acoustic echo cancellation and recording medium with the method recorded thereon Grant 6,553,122 - Shimauchi , et al. April 22, 2	2003-04-22
Bump-attached wiring circuit board and method for manufacturing same App 20030034173 - Kaneda, Yutaka ; et al.	2003-02-20
Processes for manufacturing multilayer flexible wiring boards App 20020079134 - Kaneda, Yutaka	2002-06-27
Wiring circuit board having bumps and method of producing same App 20020038721 - Kaneda, Yutaka	2002-04-04
Bump-attached wiring circuit board and method for manufacturing same App 20020005292 - Kaneda, Yutaka ; et al.	2002-01-17
Flexible printed wiring boards App 20010050434 - Kaneda, Yutaka ; et al.	2001-12-13
Processes for manufacturing flexible printed wiring boards Grant 6,294,316 - Kaneda , et al. September 25, 2	2001-09-25
Method and apparatus for dereverberation Grant 5,774,562 - Furuya , et al. June 30, 1	1998-06-30
Adaptive transfer function estimating method and estimating device using the same Grant 5,602,765 - Tanaka , et al. February 11, 1	1997-02-11
Echo cancelling method and apparatus using fast projection scheme Grant 5,539,731 - Haneda , et al. July 23, 1	1996-07-23
Echo cancelling method and echo canceller using the same Grant 5,408,530 - Makino , et al. * April 18, 1	1995-04-18
Method of detecting acoustic signal Grant 5,208,864 - Kaneda May 4, 1	1993-05-04
Acoustic transfer function simulating method and simulator using the same Grant 5,187,692 - Haneda , et al. February 16, 1	1993-02-16
Inverse control system Grant 4,683,590 - Miyoshi , et al. July 28, 1	1987-07-28
Microphone-array apparatus and method for extracting desired signal Grant 4,536,887 - Kaneda , et al. August 20, 1	1985-08-20

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