Patent | Date |
---|
Manufacturing method of semiconductor device and semiconductor device Grant 9,385,071 - Kaneda , et al. July 5, 2 | 2016-07-05 |
Semiconductor device and method of manufacturing the same Grant 9,349,675 - Kaneda May 24, 2 | 2016-05-24 |
Device for detecting insulation degradation Grant 9,335,380 - Watanabe , et al. May 10, 2 | 2016-05-10 |
Semiconductor Device And Method Of Manufacturing The Same App 20160086875 - KANEDA; YOSHIHARU | 2016-03-24 |
Semiconductor device and method of manufacturing the same Grant 9,240,368 - Kaneda January 19, 2 | 2016-01-19 |
Semiconductor Device And Method Of Manufacturing The Same App 20150357264 - KANEDA; Yoshiharu | 2015-12-10 |
Semiconductor device and method of manufacturing the same Grant 9,147,647 - Kaneda September 29, 2 | 2015-09-29 |
Manufacturing Method Of Semiconductor Device And Semiconductor Device App 20150262923 - Kaneda; Yoshiharu ;   et al. | 2015-09-17 |
Manufacturing method of semiconductor device and semiconductor device Grant 9,076,777 - Kaneda , et al. July 7, 2 | 2015-07-07 |
Insulation deterioration diagnosis apparatus Grant 9,030,210 - Watanabe , et al. May 12, 2 | 2015-05-12 |
Manufacturing Method Of Semiconductor Device And Semiconductor Device App 20150008569 - Kaneda; Yoshiharu ;   et al. | 2015-01-08 |
Manufacturing method of semiconductor device and semiconductor device Grant 8,872,316 - Kaneda , et al. October 28, 2 | 2014-10-28 |
Semiconductor Device And Method Of Manufacturing The Same App 20140124912 - Kaneda; Yoshiharu | 2014-05-08 |
Manufacturing Method Of Semiconductor Device And Semiconductor Device App 20140070389 - Kaneda; Yoshiharu ;   et al. | 2014-03-13 |
Insulation Deterioration Diagnosis Apparatus App 20120319699 - Watanabe; Yoshimasa ;   et al. | 2012-12-20 |
Device For Detecting Insulation Degradation App 20110320146 - Watanabe; Yoshimasa ;   et al. | 2011-12-29 |
Semiconductor device comprising an excess resin portion, manufacturing method thereof, and apparatus for manufacturing semiconductor device comprising a excess resin portion Grant 8,048,718 - Kiyohara , et al. November 1, 2 | 2011-11-01 |
Method of manufacturing semiconductor device having plural dicing steps Grant 7,985,624 - Kaneda July 26, 2 | 2011-07-26 |
Body to be plated, method of determining plated film thickness, and method of manufacturing semiconductor device Grant 7,875,468 - Kaneda January 25, 2 | 2011-01-25 |
Lead frame, semiconductor device, and method of manufacturing semiconductor device Grant 7,858,447 - Kaneda December 28, 2 | 2010-12-28 |
Body to be plated, method of determining plated film thickness, and method of manufacturing semiconductor device App 20090309200 - Kaneda; Yoshiharu | 2009-12-17 |
Semiconductor device and method of manufacturing same Grant 7,582,974 - Kaneda , et al. September 1, 2 | 2009-09-01 |
Lead Frame, Semiconductor Device, And Method Of Manufacturing Semiconductor Device App 20090057857 - KANEDA; Yoshiharu | 2009-03-05 |
Method Of Manufacturing Semiconductor Device App 20090057851 - KANEDA; Yoshiharu | 2009-03-05 |
Semiconductor Device And Method Of Manufacturing Same App 20080246166 - Kaneda; Yoshiharu ;   et al. | 2008-10-09 |
Semiconductor device comprising an excess resin portion, manufacturing method thereof, and apparatus for manufacturing semiconductor device comprising a excess resin portion App 20080029857 - Kiyohara; Toshinori ;   et al. | 2008-02-07 |
Partial discharge monitoring apparatus and partial discharge remote monitoring system for rotating electric machines Grant 7,165,014 - Kaneda , et al. January 16, 2 | 2007-01-16 |
Partial discharge monitoring apparatus and partial discharge remote monitoring system for rotating electric machines App 20050012507 - Kaneda, Yoshiharu ;   et al. | 2005-01-20 |
Lead frame for fabricating surface mount type semiconductor devices with high reliability Grant 6,677,666 - Kaneda , et al. January 13, 2 | 2004-01-13 |
Lead frame for fabricating surface mount type semiconductor devices with high reliability App 20030080396 - Kaneda, Yoshiharu ;   et al. | 2003-05-01 |
Lead frame for fabricating surface mount type semiconductor devices with high reliability Grant 6,507,093 - Kaneda , et al. January 14, 2 | 2003-01-14 |
Lead frame for fabricating surface mount type semiconductor devices with high reliability App 20010033008 - Kaneda, Yoshiharu ;   et al. | 2001-10-25 |