loadpatents
name:-0.01917290687561
name:-0.018192052841187
name:-0.025274991989136
Kaneda; Wataru Patent Filings

Kaneda; Wataru

Patent Applications and Registrations

Patent applications and USPTO patent grants for Kaneda; Wataru.The latest application filed is for "wiring board and method of manufacturing the same".

Company Profile
1.9.9
  • Kaneda; Wataru - Nagano JP
  • Kaneda; Wataru - Nagano-shi JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Wiring board and method of manufacturing the same
Grant 11,430,725 - Shimizu , et al. August 30, 2
2022-08-30
Wiring Board And Method Of Manufacturing The Same
App 20210202361 - Shimizu; Noriyoshi ;   et al.
2021-07-01
Wiring board and method of manufacturing the same
Grant 10,978,383 - Shimizu , et al. April 13, 2
2021-04-13
Wiring board, semiconductor package, and semiconductor device
Grant 9,780,043 - Kaneda , et al. October 3, 2
2017-10-03
Wiring Board, Semiconductor Package, And Semiconductor Device
App 20170170130 - Kaneda; Wataru ;   et al.
2017-06-15
Wiring board, semiconductor device, and method of manufacturing wiring board
Grant 9,565,775 - Shimizu , et al. February 7, 2
2017-02-07
Wiring substrate and method of manufacturing the same
Grant 9,455,219 - Shimizu , et al. September 27, 2
2016-09-27
Method of manufacturing wiring substrate
Grant 9,380,707 - Shimizu , et al. June 28, 2
2016-06-28
Wiring Board And Method Of Manufacturing The Same
App 20150282323 - Shimizu; Noriyoshi ;   et al.
2015-10-01
Wiring board
Grant 9,148,952 - Shimizu , et al. September 29, 2
2015-09-29
Wiring board, semiconductor device, and method for manufacturing wiring board
Grant 9,119,319 - Kaneda , et al. August 25, 2
2015-08-25
Wiring Board
App 20150163899 - SHIMIZU; Noriyoshi ;   et al.
2015-06-11
Wiring Board, Semiconductor Device, And Method For Manufacturing Wiring Board
App 20150102510 - Kaneda; Wataru ;   et al.
2015-04-16
Wiring board
Grant 9,000,302 - Shimizu , et al. April 7, 2
2015-04-07
Wiring Board, Semiconductor Device, And Method Of Manufacturing Wiring Board
App 20150062851 - SHIMIZU; Noriyoshi ;   et al.
2015-03-05
Wiring Board
App 20140311771 - SHIMIZU; Noriyoshi ;   et al.
2014-10-23
Wiring Substrate And Method Of Manufacturing The Same
App 20140225275 - SHIMIZU; Noriyoshi ;   et al.
2014-08-14
Method of Manufacturing Wiring Substrate
App 20140150258 - SHIMIZU; Noriyoshi ;   et al.
2014-06-05

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