Kaneda; Aizou

Patent Applications and Registrations

Patent applications and USPTO patent grants for Kaneda; Aizou.The latest application filed is for "semiconductor device and process for fabrication thereof".

Company Profile

0.13.9

Kaneda; Aizou - Yokohama JP
Kaneda; Aizou - Kanagawa-ken JP
Kaneda; Aizou - Yokohama-shi JP
Kaneda, Aizou - Kanagawa JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor device and process for fabrication thereof Grant 7,781,896 - Takeda , et al. August 24, 2	2010-08-24
Resin composition, heat-resistant resin paste and semiconductor device using these and method of preparing the same Grant 7,560,307 - Yano , et al. July 14, 2	2009-07-14
Semiconductor Device And Process For Fabrication Thereof App 20080290529 - TAKEDA; Shinji ; et al.	2008-11-27
Semiconductor device and process for fabrication thereof Grant 7,387,914 - Takeda , et al. June 17, 2	2008-06-17
Resin composition, heat-resistant resin paste and semiconductor device using these and method of preparing the same App 20060180908 - Yano; Yasuhiro ; et al.	2006-08-17
Semiconductor Device And Process For Fabrication Thereof App 20060180903 - Takeda; Shinji ; et al.	2006-08-17
Semiconductor device and process for fabrication thereof Grant 7,078,094 - Takeda , et al. July 18, 2	2006-07-18
Resin composition, heat-resistant resin paste and semiconductor device using them and method for manufacture thereof Grant 7,061,081 - Yano , et al. June 13, 2	2006-06-13
Semiconductor device and process for fabrication thereof Grant 7,057,265 - Takeda , et al. June 6, 2	2006-06-06
Semiconductor device and process for fabrication thereof Grant 7,012,320 - Takeda , et al. March 14, 2	2006-03-14
Semiconductor device and process for fabrication thereof Grant 6,855,579 - Takeda , et al. February 15, 2	2005-02-15
Semiconductor device and process for fabrication thereof App 20040253770 - Takeda, Shinji ; et al.	2004-12-16
Laminating method of film-shaped organic die-bonding material, die-bonding method, laminating machine and die-bonding apparatus, semiconductor device, and fabrication process of semiconductor device Grant 6,825,249 - Takeda , et al. November 30, 2	2004-11-30
Semiconductor device and process for fabrication thereof Grant 6,717,242 - Takeda , et al. April 6, 2	2004-04-06
Semiconductor device and process for fabrication thereof App 20030160337 - Takeda, Shinji ; et al.	2003-08-28
Semiconductor device and method for manufacturing the same Grant 6,611,064 - Kousaka , et al. August 26, 2	2003-08-26
Resin composition, heat-resistant resin paste and semiconductor device using them and method for manufacture thereof App 20030082925 - Yano, Yasuhiro ; et al.	2003-05-01
Semiconductor device and process for fabrication thereof App 20010035533 - Takeda, Shinji ; et al.	2001-11-01
Semiconductor device and process for fabrication thereof App 20010016384 - Takeda, Shinji ; et al.	2001-08-23
Semiconductor device and process for fabrication thereof App 20010009780 - Takeda, Shinji ; et al.	2001-07-26
Method of production of semiconductor device Grant 6,223,429 - Kaneda , et al. May 1, 2	2001-05-01
Laminating method of film-shaped organic die-bonding material, die-bonding method, laminating machine and die-bonding apparatus, semiconductor device, and fabrication process of semiconductor device Grant 6,099,678 - Kotato , et al. August 8, 2	2000-08-08

uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.

While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.

All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.