Kaneda; Aizo
Patent Applications and Registrations
Patent applications and USPTO patent grants for Kaneda; Aizo.The latest application filed is for "semiconductor device".
- Kaneda; Aizo - Yokohama JP
- Kaneda, Aizo - Yokohama-shi JP
- Kaneda; Aizo - Shimodate JP
- Kaneda; Aizo - Fujisawa JP
| Patent | Date |
|---|---|
| Semiconductor device Grant 6,919,622 - Murakami , et al. July 19, 2 | 2005-07-19 |
| Semiconductor device App 20040155323 - Murakami, Gen ; et al. | 2004-08-12 |
| Semiconductor device Grant 6,720,208 - Murakami , et al. April 13, 2 | 2004-04-13 |
| Semiconductor device, substrate for mounting semiconductor chip, processes for their production, adhesive, and double-sided adhesive film Grant 6,621,170 - Yamamoto , et al. September 16, 2 | 2003-09-16 |
| Semiconductor device App 20030127712 - Murakami, Gen ; et al. | 2003-07-10 |
| Semiconductor device, substrate for mounting semiconductor chip, processes for their production, adhesive, and double-sided adhesive film App 20010022404 - Yamamoto, Kazunori ; et al. | 2001-09-20 |
| Semiconductor device, semiconductor chip mounting substrate, methods of manufacturing the device and substrate, adhesive, and adhesive double coated film Grant 6,265,782 - Yamamoto , et al. July 24, 2 | 2001-07-24 |
| Semiconductor device App 20010008302 - Murakami, Gen ; et al. | 2001-07-19 |
| Semiconductor device having all outer leads extending from one side of a resin member Grant 6,100,580 - Murakami , et al. August 8, 2 | 2000-08-08 |
| Semiconductor device Grant 6,081,023 - Murakami , et al. June 27, 2 | 2000-06-27 |
| Semiconductor device chip on lead and lead on chip manufacturing Grant 6,069,029 - Murakami , et al. May 30, 2 | 2000-05-30 |
| Semiconductor device Grant 5,612,569 - Murakami , et al. March 18, 1 | 1997-03-18 |
| Semiconductor device Grant 5,530,286 - Murakami , et al. June 25, 1 | 1996-06-25 |
| Semiconductor device Grant 5,358,904 - Murakami , et al. * October 25, 1 | 1994-10-25 |
| Stacked semiconductor memory device and semiconductor memory module containing the same Grant 5,334,875 - Sugano , et al. * August 2, 1 | 1994-08-02 |
| Method for manufacturing a semiconductor device including wafer aging, probe inspection, and feeding back the results of the inspection to the device fabrication process Grant 5,219,765 - Yoshida , et al. June 15, 1 | 1993-06-15 |
| Semiconductor stacked device Grant 5,198,888 - Sugano , et al. * March 30, 1 | 1993-03-30 |
| Semiconductor device Grant 5,184,208 - Sakuta , et al. February 2, 1 | 1993-02-02 |
| Method of encapsulating semiconductor chips Grant 5,110,515 - Nakamura , et al. May 5, 1 | 1992-05-05 |
| Semiconductor device Grant 5,068,712 - Murakami , et al. November 26, 1 | 1991-11-26 |
| Method of aligning and bonding tab inner leads Grant 5,059,559 - Takahashi , et al. October 22, 1 | 1991-10-22 |
| Semiconductor device and semiconductor module with a plurality of stacked semiconductor devices Grant 5,028,986 - Sugano , et al. July 2, 1 | 1991-07-02 |
| Method of producing semiconductor devices Grant 4,946,633 - Saeki , et al. August 7, 1 | 1990-08-07 |
| Method and apparatus for encapsulating semi-conductors Grant 4,900,501 - Saeki , et al. February 13, 1 | 1990-02-13 |
| Fluid machine with resin-coated scroll members Grant 4,802,831 - Suefuji , et al. February 7, 1 | 1989-02-07 |
| Method for assembling flat type plastic multifiber connectors Grant 4,753,515 - Sato , et al. June 28, 1 | 1988-06-28 |
| Optical fiber connector Grant 4,484,796 - Sato , et al. November 27, 1 | 1984-11-27 |
| Apparatus for molding plastic Grant 4,411,609 - Yoshii , et al. October 25, 1 | 1983-10-25 |
| Spider of loudspeaker Grant 4,239,944 - Obara , et al. December 16, 1 | 1980-12-16 |
| Mold die Grant 4,126,292 - Saeki , et al. November 21, 1 | 1978-11-21 |
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