Kandanur; Sashi S.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Kandanur; Sashi S..The latest application filed is for "multi-layer flexible/stretchable electronic package for advanced wearable electronics".
- Kandanur; Sashi S. - Chandler AZ
| Patent | Date |
|---|---|
| Semiconductor package having nonspherical filler particles Grant 11,127,682 - Kandanur , et al. September 21, 2 | 2021-09-21 |
| Electronic assembly that includes void free holes Grant 10,856,424 - Boyapati , et al. December 1, 2 | 2020-12-01 |
| Method for making a flexible wearable circuit Grant 10,798,817 - Aleksov , et al. October 6, 2 | 2020-10-06 |
| Predictive capability for electroplating shield design Grant 10,428,439 - Haehn , et al. October 1, 2 | 2019-10-01 |
| Stretchable electronic assembly Grant 10,327,330 - Aleksov , et al. | 2019-06-18 |
| Multi-layer Flexible/stretchable Electronic Package For Advanced Wearable Electronics App 20180376585 - Aleksov; Aleksandar ; et al. | 2018-12-27 |
| Stretchable Electronic Assembly App 20180295720 - Aleksov; Aleksandar ; et al. | 2018-10-11 |
| Electronic Assembly That Includes Void Free Holes App 20180288885 - Boyapati; Sri Ranga Sai ; et al. | 2018-10-04 |
| Predictive Capability For Electroplating Shield Design App 20170140076 - HAEHN; Nicholas S. ; et al. | 2017-05-18 |
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