Kanda; Yuichi
Patent Applications and Registrations
Patent applications and USPTO patent grants for Kanda; Yuichi.The latest application filed is for "process for forming metal layers".
- Kanda; Yuichi - Aizuwakamatsu JP
- Kanda, Yuichi - Aizuwakamatsu-shi JP
- Kanda; Yuichi - Kitakata JP
- Kanda; Yuichi - Tokyo JA
| Patent | Date |
|---|---|
| Process for forming metal layers Grant 7,416,763 - Kanda , et al. August 26, 2 | 2008-08-26 |
| Process for forming metal layers App 20050097735 - Kanda, Yuichi ; et al. | 2005-05-12 |
| Lead frame material and lead frame for semiconductor device Grant 5,510,197 - Takahashi , et al. April 23, 1 | 1996-04-23 |
| Automatic welding machine path correction method Grant 5,066,847 - Kishi , et al. November 19, 1 | 1991-11-19 |
| Frequency To Voltage Converter With Means For Prescribing Pulse Width Against Fluctuations Grant 3,824,410 - Funaki , et al. July 16, 1 | 1974-07-16 |
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