| Patent | Date |
|---|
Rfid Inlet And Rfid Tag, And Method For Manufacturing Rfid Inlet And Rfid Tag
App 20120024959 - MINAGAWA; Madoka ; et al. | 2012-02-02 |
RFID tag
Grant 8,035,522 - Oroku , et al. October 11, 2 | 2011-10-11 |
RFID tag
Grant 8,009,047 - Kanda , et al. August 30, 2 | 2011-08-30 |
Ultrasound probe
Grant 7,969,067 - Aono , et al. June 28, 2 | 2011-06-28 |
Method for manufacturing a three-dimensional semiconductor device and a wafer used therein
Grant 7,754,581 - Ikeda , et al. July 13, 2 | 2010-07-13 |
Semiconductor device, manufacturing method thereof, and connection method of circuit board
Grant 7,615,870 - Shibamoto , et al. November 10, 2 | 2009-11-10 |
RFID Tag
App 20090096583 - Kanda; Naoya ; et al. | 2009-04-16 |
Rfid Tag
App 20090079574 - Oroku; Noriyuki ; et al. | 2009-03-26 |
Ultrasound Probe
App 20090069688 - Aono; Takanori ; et al. | 2009-03-12 |
Paper tag identified by using radiofrequency and method of manufacturing the same
Grant 7,413,130 - Inoue , et al. August 19, 2 | 2008-08-19 |
Semiconductor Element Unit And Complex Thereof, Semiconductor Device And Module Thereof, Assembled Structure Thereof And Film Substrate Connection Structure
App 20080185729 - Yamaguchi; Masahiro ; et al. | 2008-08-07 |
Method For Manufacturing A Three-dimensional Semiconductor Device And A Wafer Used Therein
App 20080164575 - Ikeda; Hiroaki ; et al. | 2008-07-10 |
Paper tag identified by using radiofrequency and method of manufacturing the same
App 20070194135 - Inoue; Kosuke ; et al. | 2007-08-23 |
RFID-chip having RFID-tag or magnifying electrode
Grant 7,190,072 - Kanda , et al. March 13, 2 | 2007-03-13 |
Paper tag identified by using radiofrequency and method of manufacturing the same
Grant 7,185,823 - Inoue , et al. March 6, 2 | 2007-03-06 |
RFID tag and manufacturing method thereof
App 20070007344 - Inoue; Kosuke ; et al. | 2007-01-11 |
Wireless communication medium and method of manufacturing the same
Grant 7,141,451 - Tsunoda , et al. November 28, 2 | 2006-11-28 |
Stacked type semiconductor device
App 20060249829 - Katagiri; Mitsuaki ; et al. | 2006-11-09 |
Semiconductor device, manufacturing method thereof, and connection method of circuit board
App 20060244121 - Shibamoto; Masanori ; et al. | 2006-11-02 |
Method of manufacturing RFID
Grant 7,122,087 - Kanda , et al. October 17, 2 | 2006-10-17 |
Semiconductor device having projected electrodes and structure for mounting the same
Grant 7,084,498 - Yamaguchi , et al. August 1, 2 | 2006-08-01 |
Semiconductor device and method for producing the same
Grant 7,057,283 - Inoue , et al. June 6, 2 | 2006-06-06 |
Semiconductor module
Grant 7,002,250 - Hozoji , et al. February 21, 2 | 2006-02-21 |
RFID-chip having RFID-tag or magnifying electrode
App 20050230791 - Kanda, Naoya ; et al. | 2005-10-20 |
Semiconductor device and method for manufacturing the same and semiconductor device-mounted structure
Grant 6,930,388 - Yamaguchi , et al. August 16, 2 | 2005-08-16 |
Paper tag identified by using radiofrequency and method of manufacturing the same
App 20050173541 - Inoue, Kosuke ; et al. | 2005-08-11 |
Method of manufacturing RFID
App 20050130425 - Kanda, Naoya ; et al. | 2005-06-16 |
Wireless communication medium and method of manufacturing the same
App 20050085010 - Tsunoda, Shigeharu ; et al. | 2005-04-21 |
Semiconductor apparatus including insulating layer having a protrusive portion
Grant 6,822,317 - Inoue , et al. November 23, 2 | 2004-11-23 |
Semiconductor device and method for producing the same
App 20040195687 - Inoue, Kosuke ; et al. | 2004-10-07 |
Multi-chip module including semiconductor devices and a wiring substrate for mounting the semiconductor devices
Grant 6,791,178 - Yamaguchi , et al. September 14, 2 | 2004-09-14 |
Method of fabricating a wafer level chip size package utilizing a maskless exposure
Grant 6,780,748 - Yamaguchi , et al. August 24, 2 | 2004-08-24 |
Method for producing a semiconductor device
Grant 6,770,547 - Inoue , et al. August 3, 2 | 2004-08-03 |
Semiconductor device and method for manufacturing the same
Grant 6,624,504 - Inoue , et al. September 23, 2 | 2003-09-23 |
Semiconductor module and method of making the device
Grant 6,610,934 - Yamaguchi , et al. August 26, 2 | 2003-08-26 |
Packaging structure and method of packaging electronic parts
Grant 6,589,802 - Asada , et al. July 8, 2 | 2003-07-08 |
Semiconductor device manufacturing method and semiconductor device
App 20030109079 - Yamaguchi, Yoshihide ; et al. | 2003-06-12 |
Semiconductor device and structure for mounting the same
App 20030071331 - Yamaguchi, Yoshihide ; et al. | 2003-04-17 |
Semiconductor module
App 20020180015 - Yamaguchi, Yoshihide ; et al. | 2002-12-05 |
Semiconductor module and method of making the device
App 20020180027 - Yamaguchi, Yoshihide ; et al. | 2002-12-05 |
Semiconductor module
App 20020079575 - Hozoji, Hiroshi ; et al. | 2002-06-27 |
Semiconductor device and method for manufacturing the same and semiconductor device-mounted structure
App 20020063332 - Yamaguchi, Yoshihide ; et al. | 2002-05-30 |
Flip-chip connecting method, flip-chip connected structure and electronic device using the same
Grant 6,153,938 - Kanda , et al. November 28, 2 | 2000-11-28 |
Semiconductor device structure
Grant 5,811,877 - Miyano , et al. September 22, 1 | 1998-09-22 |
Ion-beam sputtering apparatus and method for operating the same
Grant 5,178,738 - Ishikawa , et al. January 12, 1 | 1993-01-12 |
Method and apparatus for forming a multiple-element thin film based on ion beam sputtering
Grant 5,089,104 - Kanda , et al. February 18, 1 | 1992-02-18 |
Connecting structure of electronic part and electronic device using the structure
Grant 5,086,337 - Noro , et al. February 4, 1 | 1992-02-04 |
Electronic device plated with gold by means of an electroless gold plating solution
Grant 4,963,974 - Ushio , et al. October 16, 1 | 1990-10-16 |
Module and a substrate for the module
Grant 4,922,377 - Matsumoto , et al. May 1, 1 | 1990-05-01 |
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