Kanbe; Yoshihisa
Patent Applications and Registrations
Patent applications and USPTO patent grants for Kanbe; Yoshihisa.The latest application filed is for "wiring substrate and manufacturing method thereof".
- Kanbe; Yoshihisa - Nagano-shi JP
- KANBE; Yoshihisa - Nagano JP
| Patent | Date |
|---|---|
| Wiring Substrate And Manufacturing Method Thereof App 20220068808 - Kanbe; Yoshihisa ; et al. | 2022-03-03 |
| Wiring Board App 20220053648 - NAKAMURA; Junichi ; et al. | 2022-02-17 |
| Wiring substrate and manufacturing method thereof Grant 11,211,326 - Kanbe , et al. December 28, 2 | 2021-12-28 |
| Electronic component-incorporating substrate Grant 11,075,153 - Kanbe July 27, 2 | 2021-07-27 |
| Wiring Substrate And Manufacturing Method Thereof App 20200411432 - Kanbe; Yoshihisa ; et al. | 2020-12-31 |
| Wiring substrate and semiconductor device Grant 10,622,298 - Kanbe | 2020-04-14 |
| Electronic Component-incorporating Substrate App 20200111732 - KANBE; Yoshihisa | 2020-04-09 |
| Wiring Substrate And Semiconductor Device App 20190164879 - Kanbe; Yoshihisa | 2019-05-30 |
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