Kanayama; Shinji

Patent Applications and Registrations

Patent applications and USPTO patent grants for Kanayama; Shinji.The latest application filed is for "set of primers and probes to be used for identification of gene polymorphism and use thereof".

Company Profile

0.33.26

Kanayama; Shinji - Toyama-shi JP
Kanayama; Shinji - Kashihara JP
Kanayama; Shinji - Kashihara-shi JP
Kanayama; Shinji - Osaka JP
Kanayama; Shinji - Nara JP
Kanayama, Shinji - Nara-ken JP
Kanayama; Shinji - Kajiwara JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Set Of Primers And Probes To Be Used For Identification Of Gene Polymorphism And Use Thereof App 20160053309 - Kitani; Masakazu ; et al.	2016-02-25
Component mounting method, component mounting apparatus, and ultrasonic bonding head Grant 7,861,908 - Minamitani , et al. January 4, 2	2011-01-04
Component mounting apparatus Grant 7,827,677 - Ueno , et al. November 9, 2	2010-11-09
Component mounting apparatus Grant 7,797,820 - Shida , et al. September 21, 2	2010-09-21
Component mounting tool, and method and apparatus for mounting component using this tool Grant 7,549,567 - Higashi , et al. June 23, 2	2009-06-23
Bump formation method and bump forming apparatus for semiconductor wafer Grant 7,516,878 - Narita , et al. April 14, 2	2009-04-14
Method of forming bumps on a wafer utilizing a post-heating operation, and an apparatus therefore App 20080179378 - Imanishi; Makoto ; et al.	2008-07-31
Component mounting apparatus and component mounting method App 20080163481 - Shida; Satoshi ; et al.	2008-07-10
Method of forming bumps on a wafer utilizing a post-heating operation, and an apparatus therefore Grant 7,387,229 - Imanishi , et al. June 17, 2	2008-06-17
Component mounting method Grant 7,353,596 - Shida , et al. April 8, 2	2008-04-08
Apparatus and method for forming bump Grant 7,350,684 - Narita , et al. April 1, 2	2008-04-01
Component mounting method, component mounting apparatus, and ultrasonic bonding head App 20070187457 - Minamitani; Shozo ; et al.	2007-08-16
Electronic component mounting method and apparatus and ultrasonic bonding head Grant 7,229,854 - Minamitani , et al. June 12, 2	2007-06-12
Component Mounting Tool, And Method And Apparatus For Mounting Component Using This Tool App 20070119905 - Higashi; Kazushi ; et al.	2007-05-31
Component mounting apparatus including a polishing device Grant 7,219,419 - Higashi , et al. May 22, 2	2007-05-22
Electronic component, component mounting equipment, and component mounting method Grant 7,220,922 - Nishino , et al. May 22, 2	2007-05-22
Parts packaging device and parts packaging method App 20060185157 - Shida; Satoshi ; et al.	2006-08-24
Bump formation method and bump forming apparatus for semiconductor wafer Grant 7,052,984 - Narita , et al. May 30, 2	2006-05-30
Bump formation method and bump forming apparatus for semiconductor wafer App 20060102701 - Narita; Shoriki ; et al.	2006-05-18
Method and apparatus for correcting inclination of IC on semiconductor wafer Grant 7,031,509 - Narita , et al. April 18, 2	2006-04-18
Component mounting apparatus and component mounting method Grant 7,021,357 - Katano , et al. April 4, 2	2006-04-04
Apparatus and method for mounting component Grant 7,020,953 - Ueno , et al. April 4, 2	2006-04-04
Bump forming apparatus for charge appearance semiconductor substrate, charge removal method for charge appearance semiconductor substrate, charge removing unit for charge appearance semiconductor substrate, and charge appearance semiconductor substrate Grant 7,014,092 - Narita , et al. March 21, 2	2006-03-21
Bump Forming Apparatus For Charge Appearance Semiconductor Substrate, Charge Removal Method For Charge Appearance Semiconductor Substrate, Charge Removing Unit For Charge Appearance Semiconductor Substrate, And Charge Appearance Semiconductor Substrate Grant 7,005,368 - Narita , et al. February 28, 2	2006-02-28
Apparatus and method for mounting component App 20050283972 - Ueno, Yasuharu ; et al.	2005-12-29
Electronic component mounting method and apparatus and ultrasondic bonding head App 20050227429 - Minamitani, Shozo ; et al.	2005-10-13
Apparatus and method for forming bump App 20050191838 - Narita, Shoriki ; et al.	2005-09-01
Device and method for forming bump Grant 6,910,613 - Narita , et al. June 28, 2	2005-06-28
Method and apparatus for handling arrayed part Grant 6,830,989 - Shida , et al. December 14, 2	2004-12-14
Electric Charge Generating Semiconductor Substrate Bump Forming Device, Method Of Removing Electric Charge From Electric Charge Generating Semiconductor Substrate Device For Removing Electric Charge From Electric Charge Generating Semiconductor Substrate, And Electric Charge Generating Semiconductor Grant 6,818,975 - Narita , et al. November 16, 2	2004-11-16
Method and apparatus for handling arrayed components App 20040183910 - Shida, Satoshi ; et al.	2004-09-23
Method of forming bumps on a wafer utilizing a post-heating operation, and apparatus therefor Grant 6,787,391 - Imanishi , et al. September 7, 2	2004-09-07
Method of forming bumps on a wafer utilizing a post-heating operation, and an apparatus therefore App 20040149803 - Imanishi, Makoto ; et al.	2004-08-05
Device and method for forming bump App 20040102030 - Narita, Shoriki ; et al.	2004-05-27
Electronic component component mounting equipment and component mounting method App 20040060666 - Nishino, Kenichi ; et al.	2004-04-01
Method and device for frictional connection and holding tool used for the frictional connection device Grant 6,706,130 - Minamitani , et al. March 16, 2	2004-03-16
Bump forming apparatus for charge appearance semiconductor substrate, charge removal method for charge appearance semiconductor substrate, charge removing unit for charge appearance semiconductor substrate, and charge appearance semiconductor substrate App 20040035849 - Narita, Shoriki ; et al.	2004-02-26
Pusher, puller loader, unloader, and working device Grant 6,692,214 - Shida , et al. February 17, 2	2004-02-17
Apparatus and method for mounting component App 20040020043 - Ueno, Yasuharu ; et al.	2004-02-05
Bump bonding unit with tray storage and transport apparatuses Grant 6,647,616 - Matsumura , et al. November 18, 2	2003-11-18
Bump joining method App 20030205607 - Minamitani, Shozo ; et al.	2003-11-06
Working method for holding a work object by suction Grant 6,619,535 - Imanishi , et al. September 16, 2	2003-09-16
Component mounting tool, and method and apparatus for mounting component using this tool App 20030150108 - Higashi, Kazushi ; et al.	2003-08-14
Component mounting apparatus and component mounting method App 20030070280 - Katano, Ryoichiro ; et al.	2003-04-17
Method and apparatus for mounting component Grant 6,506,222 - Minamitani , et al. January 14, 2	2003-01-14
Component feeder with load position alignment recognition Grant 6,467,158 - Kiyomura , et al. October 22, 2	2002-10-22
Method and apparatus for correcting inclination of IC on semiconductor wafer App 20020061129 - Narita, Shoriki ; et al.	2002-05-23
Heating apparatus for bump bonding, bump bonding method and bump forming apparatus, and semiconductor wafer App 20020011479 - Narita, Shoriki ; et al.	2002-01-31
Bump joining method App 20020008132 - Minamitani, Shozo ; et al.	2002-01-24
Bump joining method Grant 6,321,973 - Minamitani , et al. November 27, 2	2001-11-27
Bump bonding apparatus and method App 20010042771 - Narita, Shoriki ; et al.	2001-11-22
Bump bonding apparatus and method App 20010042772 - Narita, Shoriki ; et al.	2001-11-22
Method and apparatus for mounting component App 20010026012 - Minamitani, Shozo ; et al.	2001-10-04
Method and apparatus for mounting component App 20010001469 - Higashi, Kazushi ; et al.	2001-05-24
Component mounting method and apparatus Grant 6,193,136 - Higashi , et al. February 27, 2	2001-02-27
Bump bonding method and bump bonding apparatus Grant 6,017,812 - Yonezawa , et al. January 25, 2	2000-01-25
Mounting apparatus for electronic component Grant 5,894,657 - Kanayama , et al. April 20, 1	1999-04-20
Method and apparatus for mounting electronic component Grant 5,854,745 - Muraoka , et al. December 29, 1	1998-12-29
Linear actuating apparatus Grant 5,783,915 - Shida , et al. July 21, 1	1998-07-21

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