KANAMARU; Tatsuya

Patent Applications and Registrations

Patent applications and USPTO patent grants for KANAMARU; Tatsuya.The latest application filed is for "liquid resin composition, die attaching method using same and semiconductor device having cured product of same".

Company Profile

0.9.9

KANAMARU; Tatsuya - Tokyo JP
Kanamaru; Tatsuya - Kitasaku-gun JP
KANAMARU; Tatsuya - Karuizawa-machi JP
Kanamaru; Tatsuya - Gunma-ken JP
Kanamaru; Tatsuya - Aichi JP
Kanamaru; Tatsuya - Tokai JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Liquid Resin Composition, Die Attaching Method Using Same And Semiconductor Device Having Cured Product Of Same App 20170158926 - TSUDA; Koichi ; et al.	2017-06-08
Epoxy resin composition, die attach method using same, and semiconductor device containing cured product thereof Grant 8,815,400 - Kanamaru , et al. August 26, 2	2014-08-26
Electroconductive Liquid Resin Composition And An Electronic Part App 20130175485 - KANAMARU; Tatsuya ; et al.	2013-07-11
Epoxy Resin Composition, Die Attach Method Using Same, And Semiconductor Device Containing Cured Product Thereof App 20120193817 - KANAMARU; Tatsuya ; et al.	2012-08-02
Adhesive composition suitable to be applied by screen printing Grant 8,110,066 - Kanamaru , et al. February 7, 2	2012-02-07
Adhesive composition suitable to be applied by screen printing App 20080308225 - Kanamaru; Tatsuya ; et al.	2008-12-18
Flip-chip type semiconductor device Grant 6,794,058 - Honda , et al. September 21, 2	2004-09-21
Liquid epoxy resin composition and semiconductor device Grant 6,733,902 - Sumita , et al. May 11, 2	2004-05-11
Silicone-modified epoxy or phenolic resin compositions and semiconductor devices sealed therewith Grant 6,709,753 - Honda , et al. March 23, 2	2004-03-23
Light-transmissive epoxy resin composition and semiconductor device Grant 6,627,328 - Kanamaru , et al. September 30, 2	2003-09-30
Flip-chip type semiconductor device App 20030144382 - Honda, Tsuyoshi ; et al.	2003-07-31
Liquid epoxy resin composition and semiconductor device App 20030069349 - Sumita, Kazuaki ; et al.	2003-04-10
Silicone-modified epoxy or phenolic resin compositions and semiconductor devices sealed therewith App 20020192477 - Honda, Tsuyoshi ; et al.	2002-12-19
Light-transmissive epoxy resin composition and semiconductor device App 20020058145 - Kanamaru, Tatsuya ; et al.	2002-05-16
Light-transmissive epoxy resin composition and flip-chip type semiconductor device App 20020058742 - Honda, Tsuyoshi ; et al.	2002-05-16
Galvannealed steel sheet with distinguished anti-powdering and anti-flaking properties and process for producing the same Grant 5,049,453 - Suemitsu , et al. September 17, 1	1991-09-17
Process for electroplating a metallic material with an iron-zinc alloy Grant 4,578,158 - Kanamaru , et al. March 25, 1	1986-03-25

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