KANAKARAJAN; Kuppusamy

Patent Applications and Registrations

Patent applications and USPTO patent grants for KANAKARAJAN; Kuppusamy.The latest application filed is for "colorless transparent copolyamide-imide films with high modulus and low coefficient of thermal expansion and preparation thereof".

Company Profile

0.15.19

KANAKARAJAN; Kuppusamy - Dublin OH
KANAKARAJAN; KUPPUSAMY - US
Kanakarajan; Kuppusamy - Columbus OH

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Colorless Transparent Copolyamide-imide Films With High Modulus And Low Coefficient Of Thermal Expansion And Preparation Thereof App 20210309804 - PERUMAL; Karthikeyan ; et al.	2021-10-07
Colored polyimide films and methods relating thereto Grant 9,303,136 - Becks , et al. April 5, 2	2016-04-05
Colored Polyimide Films And Methods Relating Thereto App 20140103265 - Becks; Christopher ; et al.	2014-04-17
Colored Polyimide Films And Methods Relating Thereto App 20140093714 - Becks; Christopher Robert ; et al.	2014-04-03
Multi-layer article for flexible printed circuits Grant 8,440,292 - Kanakarajan , et al. May 14, 2	2013-05-14
Aramid filled polyimides having advantageous thermal expansion properties, and methods relating thereto Grant 8,124,223 - Kanakarajan , et al. February 28, 2	2012-02-28
Aramid Filled Polyimides Having Advantageous Thermal Expansion Properties, And Methods Relating Thereto App 20100311901 - KANAKARAJAN; KUPPUSAMY ; et al.	2010-12-09
Multi-layer Article For Flexible Printed Circuits App 20100291371 - Kanakarajan; Kuppusamy ; et al.	2010-11-18
Aramid filled polyimides having advantageous thermal expansion properties, and methods relating thereto Grant 7,790,276 - Kanakarajan September 7, 2	2010-09-07
Multilayer Insulation For Wire, Cable Or Other Conductive Materials App 20090297858 - GLENN; DANNY E. ; et al.	2009-12-03
Laminate Structures For High Temperature Photovoltaic Applications, And Methods Relating Thereto App 20090288699 - Auman; Brian C. ; et al.	2009-11-26
Process For Preparing Polyimide Based Compositions Useful In High Frequency Circuitry Applications App 20090242823 - Kanakarajan; Karthikeyan ; et al.	2009-10-01
Polyimide composite coverlays and methods and compositions relating thereto Grant 7,579,134 - Dueber , et al. August 25, 2	2009-08-25
Thermally Conductive Aramid-based Dielectric Substrates For Printed Circuit Boards And Integrated Circuit Chip Packaging App 20090142567 - Kanakarajan; Kuppusamy ; et al.	2009-06-04
Low-temperature curable photosensitive compositions Grant 7,524,617 - Dueber , et al. April 28, 2	2009-04-28
Multi-layer Laminate Substrates Useful In Electronic Type Applications App 20090025867 - Kanakarajan; Kuppusamy ; et al.	2009-01-29
Low-temperature curable photosensitive compositions Grant 7,476,489 - Dueber , et al. January 13, 2	2009-01-13
Low temperature polyimide adhesive compositions and methods relating thereto Grant 7,348,080 - Kanakarajan March 25, 2	2008-03-25
Low temperature polyimide adhesive compositions and methods relating thereto Grant 7,348,064 - Kanakarajan March 25, 2	2008-03-25
Low temperature cure polyimide compositions resistant to arc tracking and methods relating thereto Grant 7,338,715 - Kanakarajan March 4, 2	2008-03-04
Multi-layer laminate substrates useful in electronic type applications App 20070298260 - Kanakarajan; Kuppusamy ; et al.	2007-12-27
Polyimide based compositions useful in high frequency circuitry applications and methods relating thereto App 20070232734 - Kanakarajan; Karthikeyan ; et al.	2007-10-04
Capacitive polyimide laminate App 20070231588 - Kanakarajan; Karthikeyan ; et al.	2007-10-04
Aramid filled polyimides having advantageous thermal expansion properties, and methods relating thereto App 20070231568 - Kanakarajan; Kuppusamy	2007-10-04
Low temperature polyimide adhesive compositions and methods relating thereto Grant 7,026,436 - Kanakarajan April 11, 2	2006-04-11
Low temperature polyimide adhesive compositions and methods relating thereto App 20060068211 - Kanakarajan; Kuppusamy	2006-03-30
Low temperature polyimide adhesive compositions and methods relating thereto App 20060068210 - Kanakarajan; Kuppusamy	2006-03-30
Low temperature polyimide adhesive compositions and methods relating thereto App 20040099374 - Kanakarajan, Kuppusamy	2004-05-27
Flexible multi-layer polyimide film laminates and preparation thereof Grant 5,411,765 - Kanakarajan , et al. May 2, 1	1995-05-02
Hexaazatriphenylene hexanitrile and its derivatives and their preparations Grant 4,780,536 - Czarnik , et al. October 25, 1	1988-10-25

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