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name:-0.036544799804688
name:-0.013452053070068
Kanakamedala; Senaka Patent Filings

Kanakamedala; Senaka

Patent Applications and Registrations

Patent applications and USPTO patent grants for Kanakamedala; Senaka.The latest application filed is for "three-dimensional memory device including discrete charge storage elements with laterally-protruding profiles and methods of making thereof".

Company Profile
16.34.47
  • Kanakamedala; Senaka - San Jose CA
  • Kanakamedala; Senaka - Milpitas CA
  • KANAKAMEDALA; Senaka - Boise ID
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Multibit ferroelectric memory cells and methods for forming the same
Grant 11,450,687 - Tirukkonda , et al. September 20, 2
2022-09-20
Three-dimensional Memory Device Including Discrete Charge Storage Elements With Laterally-protruding Profiles And Methods Of Making Thereof
App 20220285386 - SAID; Ramy Nashed Bassely ;   et al.
2022-09-08
Three-dimensional Memory Device Including Discrete Charge Storage Elements And Methods For Forming The Same
App 20220278216 - PITNER; Xue Bai ;   et al.
2022-09-01
Semiconductor device including having metal organic framework interlayer dielectric layer between metal lines and methods of forming the same
Grant 11,430,736 - Said , et al. August 30, 2
2022-08-30
Three-dimensional Memory Device Including Multi-bit Charge Storage Elements And Methods For Forming The Same
App 20220254797 - SAID; Ramy Nashed Bassely ;   et al.
2022-08-11
Three-dimensional Memory Array Including Dual Work Function Floating Gates And Method Of Making The Same
App 20220254798 - SAID; Ramy Nashed Bassely ;   et al.
2022-08-11
Three Dimensional Semiconductor Device Containing Composite Contact Via Structures And Methods Of Making The Same
App 20220246517 - TITUS; Monica ;   et al.
2022-08-04
Three-dimensional memory device employing thinned insulating layers and methods for forming the same
Grant 11,398,496 - Kai , et al. July 26, 2
2022-07-26
Bonded assembly containing oxidation barriers, hybrid bonding, or air gap, and methods of forming the same
Grant 11,393,780 - Said , et al. July 19, 2
2022-07-19
Method Of Making A Three-dimensional Memory Device Using Composite Hard Masks For Formation Of Deep Via Openings
App 20220223470 - TIRUKKONDA; Roshan Jayakhar ;   et al.
2022-07-14
Three-dimensional memory device containing metal-organic framework inter-word line insulating layers
Grant 11,387,250 - Said , et al. July 12, 2
2022-07-12
Three-dimensional memory device including discrete charge storage elements and methods of forming the same
Grant 11,387,244 - Makala , et al. July 12, 2
2022-07-12
Method Of Making A Three-dimensional Memory Device Using Composite Hard Masks For Formation Of Deep Via Openings
App 20220208776 - TITUS; Monica ;   et al.
2022-06-30
Method Of Making A Three-dimensional Memory Device Using Composite Hard Masks For Formation Of Deep Via Openings
App 20220208556 - TIRUKKONDA; Roshan Jayakhar ;   et al.
2022-06-30
Method Of Making A Three-dimensional Memory Device Using Composite Hard Masks For Formation Of Deep Via Openings
App 20220208600 - TIRUKKONDA; Roshan Jayakhar ;   et al.
2022-06-30
Method Of Making A Three-dimensional Memory Device Using Composite Hard Masks For Formation Of Deep Via Openings
App 20220208785 - TITUS; Monica ;   et al.
2022-06-30
Multibit Ferroelectric Memory Cells And Methods For Forming The Same
App 20220189993 - TIRUKKONDA; Roshan ;   et al.
2022-06-16
Three-dimensional Memory Device Containing Ferroelectric-assisted Memory Elements And Method Of Making The Same
App 20220139960 - SAID; Ramy Nashed Bassely ;   et al.
2022-05-05
Three-dimensional memory device including an inter-tier etch stop layer and method of making the same
Grant 11,296,101 - Lee , et al. April 5, 2
2022-04-05
Semiconductor device containing metal-organic framework inter-line insulator structures and methods of manufacturing the same
Grant 11,296,028 - Said , et al. April 5, 2
2022-04-05
Three-dimensional Memory Device Including Discrete Charge Storage Elements And Methods Of Forming The Same
App 20220093644 - SHARANGPANI; Rahul ;   et al.
2022-03-24
Semiconductor Device Including Having Metal Organic Framework Interlayer Dielectric Layer Between Metal Lines And Methods Of Forming The Same
App 20220059462 - SAID; Ramy Nashed Bassely ;   et al.
2022-02-24
Three-dimensional memory device including molybdenum word lines and metal oxide spacers and method of making the same
Grant 11,244,953 - Kanakamedala , et al. February 8, 2
2022-02-08
Semiconductor structure containing reentrant shaped bonding pads and methods of forming the same
Grant 11,201,139 - Sharangpani , et al. December 14, 2
2021-12-14
Bonded assembly containing metal-organic framework bonding dielectric and methods of forming the same
Grant 11,171,097 - Said , et al. November 9, 2
2021-11-09
Three-dimensional Memory Device Employing Thinned Insulating Layers And Methods For Forming The Same
App 20210335805 - KAI; James ;   et al.
2021-10-28
Three-dimensional Memory Device Employing Thinned Insulating Layers And Methods For Forming The Same
App 20210335999 - KAI; James ;   et al.
2021-10-28
Three-dimensional Memory Device Including Discrete Charge Storage Elements And Methods Of Forming The Same
App 20210327890 - MAKALA; Raghuveer S. ;   et al.
2021-10-21
Three-dimensional Memory Device Including Discrete Charge Storage Elements And Methods Of Forming The Same
App 20210327889 - MAKALA; Raghuveer S. ;   et al.
2021-10-21
Semiconductor structure containing reentrant shaped bonding pads and methods of forming the same
Grant 11,145,628 - Sharangpani , et al. October 12, 2
2021-10-12
Three-dimensional Memory Device Including An Inter-tier Etch Stop Layer And Method Of Making The Same
App 20210305266 - Lee; Yao-Sheng ;   et al.
2021-09-30
Semiconductor Structure Containing Reentrant Shaped Bonding Pads And Methods Of Forming The Same
App 20210296285 - SHARANGPANI; Rahul ;   et al.
2021-09-23
Semiconductor Structure Containing Reentrant Shaped Bonding Pads And Methods Of Forming The Same
App 20210296284 - SHARANGPANI; Rahul ;   et al.
2021-09-23
Warpage-compensated bonded structure including a support chip and a three-dimensional memory chip
Grant 11,114,406 - Kanakamedala , et al. September 7, 2
2021-09-07
Three-dimensional Memory Device Including Molybdenum Word Lines And Metal Oxide Spacers And Method Of Making The Same
App 20210265372 - KANAKAMEDALA; Senaka ;   et al.
2021-08-26
Bonded Assembly Containing Metal-organic Framework Bonding Dielectric And Methods Of Forming The Same
App 20210233881 - SAID; Ramy Nashed Bassely ;   et al.
2021-07-29
Three-dimensional Memory Device Containing Metal-organic Framework Inter-word Line Insulating Layers And Methods Of Forming The Same
App 20210193674 - SAID; Ramy Nashed Bassely ;   et al.
2021-06-24
Semiconductor Device Containing Metal-organic Framework Inter-line Insulator Structures And Methods Of Manufacturing The Same
App 20210193585 - SAID; Ramy Nashed Bassely ;   et al.
2021-06-24
Multilevel Memory Stack Structure With Tapered Inter-tier Joint Region And Methods Of Making Thereof
App 20210066347 - Titus; Monica ;   et al.
2021-03-04
Reusable support substrate for formation and transfer of semiconductor devices and methods of using the same
Grant 10,910,272 - Zhou , et al. February 2, 2
2021-02-02
Bonded Assembly Containing Oxidation Barriers, Hybrid Bonding, Or Air Gap, And Methods Of Forming The Same
App 20210028135 - SAID; Ramy Nashed Bassely ;   et al.
2021-01-28
Bonded Assembly Containing Oxidation Barriers, Hybrid Bonding, Or Air Gap, And Methods Of Forming The Same
App 20210028136 - SAID; Ramy Nashed Bassely ;   et al.
2021-01-28
Warpage-compensated bonded structure including a support chip and a three-dimensional memory chip
Grant 10,847,408 - Makala , et al. November 24, 2
2020-11-24
Three-dimensional memory device containing channels with laterally pegged dielectric cores
Grant 10,748,925 - Tsutsumi , et al. A
2020-08-18
Warpage-compensated Bonded Structure Including A Support Chip And A Three-dimensional Memory Chip
App 20200251374 - Kind Code
2020-08-06
Warpage-compensated Bonded Structure Including A Support Chip And A Three-dimensional Memory Chip
App 20200251443 - Kind Code
2020-08-06
Three-dimensional Memory Device Containing Channels With Laterally Pegged Dielectric Cores And Methods For Making The Same
App 20200251486 - Kind Code
2020-08-06
Three-dimensional memory device with semicircular metal-semiconductor alloy floating gate electrodes and methods of making thereof
Grant 10,622,368 - Kanakamedala , et al.
2020-04-14
Three-dimensional memory device including contact via structures that extend through word lines and method of making the same
Grant 10,622,369 - Zhou , et al.
2020-04-14
Three-dimensional Memory Device With Semicircular Metal-semiconductor Alloy Floating Gate Electrodes And Methods Of Making There
App 20190371803 - Kanakamedala; Senaka ;   et al.
2019-12-05
Damascene process for forming three-dimensional cross rail phase change memory devices
Grant 10,468,596 - Makala , et al. No
2019-11-05
Damascene Process For Forming Three-dimensional Cross Rail Phase Change Memory Devices
App 20190259946 - Makala; Raghuveer S. ;   et al.
2019-08-22
Three-dimensional Memory Device Including Contact Via Structures That Extend Through Word Lines And Method Of Making The Same
App 20190229125 - Zhou; Fei ;   et al.
2019-07-25
Three-dimensional memory device with silicided word lines, air gap layers and discrete charge storage elements, and method of making thereof
Grant 10,256,247 - Kanakamedala , et al.
2019-04-09
Multilevel Memory Stack Structure With Tapered Inter-tier Joint Region And Methods Of Making Thereof
App 20180331117 - TITUS; Monica ;   et al.
2018-11-15
Three-dimensional memory device having drain select level isolation structure and method of making thereof
Grant 10,050,054 - Zhang , et al. August 14, 2
2018-08-14
Cobalt-containing conductive layers for control gate electrodes in a memory structure
Grant 9,984,963 - Peri , et al. May 29, 2
2018-05-29
Three-dimensional Memory Device Having Drain Select Level Isolation Structure And Method Of Making Thereof
App 20180097009 - ZHANG; Yanli ;   et al.
2018-04-05
Ridged word lines for increasing control gate lengths in a three-dimensional memory device
Grant 9,893,081 - Kanakamedala , et al. February 13, 2
2018-02-13
Three-dimensional Memory Device With Semicircular Metal-semiconductor Alloy Floating Gate Electrodes And Methods Of Making Thereof
App 20180040623 - Kanakamedala; Senaka ;   et al.
2018-02-08
Ridged Word Lines For Increasing Control Gate Lengths In A Three-dimensional Memory Device
App 20180040627 - Kanakamedala; Senaka ;   et al.
2018-02-08
Three-dimensional memory device containing a lateral source contact and method of making the same
Grant 9,824,966 - Kanakamedala , et al. November 21, 2
2017-11-21
Three-dimensional memory device containing vertically isolated charge storage regions and method of making thereof
Grant 9,812,463 - Sharangpani , et al. November 7, 2
2017-11-07
Vertical floating gate NAND with selectively deposited ALD metal films
Grant 9,806,090 - Sharangpani , et al. October 31, 2
2017-10-31
Three-dimensional Memory Device Containing Vertically Isolated Charge Storage Regions And Method Of Making Thereof
App 20170278859 - SHARANGPANI; Rahul ;   et al.
2017-09-28
Crystalinity-dependent aluminum oxide etching for self-aligned blocking dielectric in a memory structure
Grant 9,659,955 - Sharangpani , et al. May 23, 2
2017-05-23
NAND memory strings and methods of fabrication thereof
Grant 9,646,990 - Koka , et al. May 9, 2
2017-05-09
Crystalinity-dependent Aluminum Oxide Etching For Self-aligned Blocking Dielectric In A Memory Structure
App 20170125436 - SHARANGPANI; Rahul ;   et al.
2017-05-04
Three-dimensional memory device with metal and silicide control gates
Grant 9,627,399 - Kanakamedala , et al. April 18, 2
2017-04-18
Three-dimensional Memory Device With Metal And Silicide Control Gates
App 20170025431 - KANAKAMEDALA; Senaka ;   et al.
2017-01-26
Cobalt-containing Conductive Layers For Control Gate Electrodes In A Memory Structure
App 20160351497 - Peri; Somesh ;   et al.
2016-12-01
Semiconductor structure with concave blocking dielectric sidewall and method of making thereof by isotropically etching the blocking dielectric layer
Grant 9,478,558 - Koka , et al. October 25, 2
2016-10-25
Vertical Floating Gate Nand With Selectively Deposited Ald Metal Films
App 20160293617 - SHARANGPANI; Rahul ;   et al.
2016-10-06
Nand Memory Strings And Methods Of Fabrication Thereof
App 20160284730 - KOKA; Sateesh ;   et al.
2016-09-29
Semiconductor Structure With Concave Blocking Dielectric Sidewall And Method Of Making Thereof By Isotropically Etching The Blocking Dielectric Layer
App 20160211272 - Koka; Sateesh ;   et al.
2016-07-21
Vertical floating gate NAND with selectively deposited ALD metal films
Grant 9,379,124 - Sharangpani , et al. June 28, 2
2016-06-28
NAND memory strings and methods of fabrication thereof
Grant 9,379,132 - Koka , et al. June 28, 2
2016-06-28
Nand Memory Strings And Methods Of Fabrication Thereof
App 20160118397 - KOKA; Sateesh ;   et al.
2016-04-28
Method of making a three dimensional NAND device
Grant 9,305,849 - Tsutsumi , et al. April 5, 2
2016-04-05
Three dimensional NAND device and method of making thereof
Grant 9,236,396 - Koka , et al. January 12, 2
2016-01-12
Vertical Floating Gate NAND with Selectively Deposited ALD Metal Films
App 20150380422 - Sharangpani; Rahul ;   et al.
2015-12-31

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