Kanagawa; Shinji
Patent Applications and Registrations
Patent applications and USPTO patent grants for Kanagawa; Shinji.The latest application filed is for "bump formation method and bump forming apparatus to semiconductor wafer".
- Kanagawa; Shinji - San Jose CA
- Kanagawa, Shinji - Kashihara-shi Nara JP
- Kanagawa, Shinji - Kanagawa JP
- Kanagawa; Shinji - Isehara JP
| Patent | Date |
|---|---|
| Sealing of flat-panel device Grant 7,473,152 - Ludwig , et al. January 6, 2 | 2009-01-06 |
| Sealing of flat-panel device Grant 6,722,937 - Ludwig , et al. April 20, 2 | 2004-04-20 |
| Bump formation method and bump forming apparatus to semiconductor wafer App 20040020973 - Narita, Shoriki ; et al. | 2004-02-05 |
| Image display apparatus and manufacturing method therefor App 20030038586 - Iguchi, Yukinobu ; et al. | 2003-02-27 |
| Image display apparatus with rectangular-shaped spacers having added tensions Grant 6,483,235 - Iguchi , et al. November 19, 2 | 2002-11-19 |
| Method of manufacturing color-filter-fitted board for liquid crystal display Grant 5,314,771 - Yamauchi , et al. May 24, 1 | 1994-05-24 |
| Method of forming a color filter for a liquid crystal color display apparatus Grant 5,206,750 - Aizawa , et al. April 27, 1 | 1993-04-27 |
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