Kamp; Tom

Patent Applications and Registrations

Patent applications and USPTO patent grants for Kamp; Tom.The latest application filed is for "method for forming square spacers".

Company Profile

3.9.9

Kamp; Tom - San Jose CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Self limiting lateral atomic layer etch Grant 10,714,354 - Kamp , et al.	2020-07-14
Gas plenum arrangement for improving etch non-uniformity in transformer-coupled plasma systems Grant 10,431,426 - Kamp , et al. O	2019-10-01
Method For Forming Square Spacers App 20190189447 - KAMP; Tom ; et al.	2019-06-20
Self Limiting Lateral Atomic Layer Etch App 20170178917 - Kamp; Tom ; et al.	2017-06-22
Self limiting lateral atomic layer etch Grant 9,620,376 - Kamp , et al. April 11, 2	2017-04-11
Self Limiting Lateral Atomic Layer Etch App 20170053808 - Kamp; Tom ; et al.	2017-02-23
Gas Plenum Arrangement For Improving Etch Non-uniformity In Transformer-coupled Plasma Systems App 20170032931 - KAMP; Tom ; et al.	2017-02-02
Systems and methods for improving wafer etch non-uniformity when using transformer-coupled plasma Grant 9,484,214 - Kamp , et al. November 1, 2	2016-11-01
Integrated etch/clean for dielectric etch applications Grant 9,396,961 - Arghavani , et al. July 19, 2	2016-07-19
Integrated Etch/clean For Dielectric Etch Applications App 20160181117 - Arghavani; Reza ; et al.	2016-06-23
Systems And Methods For Improving Wafer Etch Non-uniformity When Using Transformer-coupled Plasma App 20150235808 - Kamp; Tom ; et al.	2015-08-20
Controlling CD and CD uniformity with trim time and temperature on a wafer by wafer basis Grant 9,012,243 - Kimura , et al. April 21, 2	2015-04-21
Controlling Cd And Cd Uniformity With Trim Time And Temperature On A Wafer By Wafer Basis App 20150053347 - Kimura; Yoshie ; et al.	2015-02-26
Plasma etch method to reduce micro-loading Grant 8,901,004 - Kamp , et al. December 2, 2	2014-12-02
Controlling CD and CD uniformity with trim time and temperature on a wafer by wafer basis Grant 8,852,964 - Kimura , et al. October 7, 2	2014-10-07
Controlling Cd And Cd Uniformity With Trim Time And Temperature On A Wafer By Wafer Basis App 20140220709 - Kimura; Yoshie ; et al.	2014-08-07
Plasma Etch Method To Reduce Micro-loading App 20110021029 - Kamp; Tom ; et al.	2011-01-27

uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.

While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.

All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.