Kamiyama; Seiichi
Patent Applications and Registrations
Patent applications and USPTO patent grants for Kamiyama; Seiichi.The latest application filed is for "semiconductor device".
- Kamiyama; Seiichi - Kanazawa Ishikawa JP
- Kamiyama; Seiichi - Hyogo-ken JP
- Kamiyama; Seiichi - Tokyo JA
| Patent | Date |
|---|---|
| Source electrode and connector lead with notched portions for a semiconductor package Grant 11,348,862 - Kamiyama May 31, 2 | 2022-05-31 |
| Semiconductor Device App 20210296214 - KAMIYAMA; Seiichi | 2021-09-23 |
| Semiconductor device including transistor Grant 9,401,398 - Matsuoka , et al. July 26, 2 | 2016-07-26 |
| Flame resistant molding resin composition Grant 3,896,185 - Yonemitsu , et al. July 22, 1 | 1975-07-22 |
| Thermoplastic blended resinous composition containing polyphenylene ether Grant 3,887,647 - Yonemitsu , et al. June 3, 1 | 1975-06-03 |
| Resinous compositions containing polyphenylene ether, styrene rubber and rubber-modified chlorostyrene polymer Grant 3,887,646 - Yonemitsu , et al. June 3, 1 | 1975-06-03 |
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