Kamiyama; Hiroharu
Patent Applications and Registrations
Patent applications and USPTO patent grants for Kamiyama; Hiroharu.The latest application filed is for "process for producing coaxial conductor interconnection wiring board".
- Kamiyama; Hiroharu - Shimodate JP
| Patent | Date |
|---|---|
| Process for producing coaxial conductor interconnection wiring board Grant 5,323,534 - Iwasaki , et al. June 28, 1 | 1994-06-28 |
| Coaxial conductor interconnection wiring board Grant 5,233,133 - Iwasaki , et al. August 3, 1 | 1993-08-03 |
| Method of making printed circuit board Grant 4,268,614 - Ueyama , et al. May 19, 1 | 1981-05-19 |
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