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name:-0.0083208084106445
name:-0.0066540241241455
name:-0.001478910446167
Kamiyama; Eiji Patent Filings

Kamiyama; Eiji

Patent Applications and Registrations

Patent applications and USPTO patent grants for Kamiyama; Eiji.The latest application filed is for "image data processing method and image creating method".

Company Profile
0.12.12
  • Kamiyama; Eiji - Tokyo JP
  • Kamiyama; Eiji - Noda JP
  • Kamiyama; Eiji - Chiba-ken JP
  • Kamiyama; Eiji - Noda-shi JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Image data processing method and image creating method
Grant 8,761,488 - Kamiyama , et al. June 24, 2
2014-06-24
Method for judging whether semiconductor wafer is non-defective wafer by using laser scattering method
Grant 8,379,196 - Kamiyama , et al. February 19, 2
2013-02-19
System and method of two-stepped laser scattering defect inspection
Grant 8,339,593 - Kamiyama , et al. December 25, 2
2012-12-25
Wafer surface measuring apparatus
Grant 8,284,395 - Kamiyama , et al. October 9, 2
2012-10-09
Image Data Processing Method And Image Creating Method
App 20110194753 - Kamiyama; Eiji ;   et al.
2011-08-11
Method of manufacturing a SOI structure having a SiGe layer interposed between the silicon and the insulator
Grant 7,947,572 - Park , et al. May 24, 2
2011-05-24
Method For Judging Whether Semiconductor Wafer Is Non-defective Wafer By Using Laser Scattering Method
App 20100309461 - Kamiyama; Eiji ;   et al.
2010-12-09
Method for manufacturing SOI wafer
Grant 7,838,387 - Kamiyama , et al. November 23, 2
2010-11-23
Method Of Manufacturing A Soi Structure Having A Sige Layer Interposed Between The Silicon And The Insulator
App 20100221877 - Park; Jeagun ;   et al.
2010-09-02
Wafer Surface Measuring Apparatus
App 20100201976 - KAMIYAMA; Eiji ;   et al.
2010-08-12
SOI structure having a SiGe layer interposed between the silicon and the insulator
Grant 7,741,193 - Park , et al. June 22, 2
2010-06-22
Laser Scattering Defect Inspection System And Laser Scattering Defect Inspection Method
App 20100085561 - KAMIYAMA; Eiji ;   et al.
2010-04-08
SOI substrate, silicon substrate therefor and it's manufacturing method
Grant 7,655,315 - Kamiyama , et al. February 2, 2
2010-02-02
Semiconductor Wafer Surface Inspection Apparatus
App 20090147250 - TANAKA; Terunori ;   et al.
2009-06-11
Bonded semiconductor substrate manufacturing method thereof
Grant 7,491,342 - Kamiyama , et al. February 17, 2
2009-02-17
Silicon Wafer For Manufacturing Soi Wafer, Soi Wafer, And Method For Manufacturing Soi Wafer
App 20080213989 - Kamiyama; Eiji ;   et al.
2008-09-04
SOI substrate, silicon substrate therefor and it's manufacturing method
App 20070228522 - Kamiyama; Eiji
2007-10-04
SOI structure having a SiGe layer interposed between the silicon and the insulator
Grant 7,180,138 - Park , et al. February 20, 2
2007-02-20
Laminated semiconductor substrate process for producing the same
App 20060118935 - Kamiyama; Eiji ;   et al.
2006-06-08
SOI structure having a sige layer interposed between the silicon and the insulator
App 20060063356 - Park; Jeagun ;   et al.
2006-03-23
SOI structure having a sige layer interposed between the silicon and the insulator
App 20050242396 - Park, Jeagun ;   et al.
2005-11-03
SOI structure having a SiGe Layer interposed between the silicon and the insulator
App 20030230778 - Park, Jeagun ;   et al.
2003-12-18

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