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Pressure-sensitive adhesive composition
Grant 10,836,937 - Suzuki , et al. November 17, 2 | 2020-11-17 |
Functionalized Laminated Optical Element with Improved Edging Resistance
App 20190111641 - COUE; Violaine ; et al. | 2019-04-18 |
Adhesive, adhesive layer, and adhesive sheet
Grant 9,657,197 - Higashi , et al. May 23, 2 | 2017-05-23 |
Radiation-curable pressure-sensitive adhesive, radiation-curable pressure-sensitive adhesive layer, radiation-curable pressure-sensitive adhesive sheet, and laminate
Grant 9,650,547 - Shigetomi , et al. May 16, 2 | 2017-05-16 |
Adhesive, Adhesive Layer, And Adhesive Sheet
App 20170002235 - HIGASHI; Masatsugu ; et al. | 2017-01-05 |
Pressure-sensitive adhesive layer for transparent conductive film, transparent conductive film with pressure-sensitive adhesive layer, transparent conductive laminate, and touch panel
Grant 9,527,944 - Tanaka , et al. December 27, 2 | 2016-12-27 |
Pressure-sensitive Adhesive Composition
App 20160369136 - SUZUKI; Tatsuya ; et al. | 2016-12-22 |
Pressure-sensitive Adhesive, Pressure-sensitive Adhesive Layer, And Pressure-sensitive Adhesive Sheet
App 20150010754 - Higashi; Masatsugu ; et al. | 2015-01-08 |
Pressure-sensitive Adhesive, Pressure Sensitive Adhesive Layer, Pressure-sensitive Adhesive Sheet, And Touch Panel
App 20140272201 - TAKEDA; Ai ; et al. | 2014-09-18 |
Adhesive, Adhesive Layer, And Adhesive Sheet
App 20140248489 - Higashi; Masatsugu ; et al. | 2014-09-04 |
Radiation-curable Pressure-sensitive Adhesive Layer, And Radiation-curable Pressure-sensitive Adhesive Sheet
App 20140039128 - Shigetomi; Kiyoe ; et al. | 2014-02-06 |
Radiation-curable Pressure-sensitive Adhesive, Radiation-curable Pressure-sensitive Adhesive Layer, Radiation-curable Pressure-sensitive Adhesive Sheet, And Laminate
App 20140037952 - SHIGETOMI; Kiyoe ; et al. | 2014-02-06 |
Dicing/die bonding film
Grant 8,617,928 - Kamiya , et al. December 31, 2 | 2013-12-31 |
Dicing/die bonding film
Grant 08617928 - | 2013-12-31 |
Active Energy Ray-Curable Pressure-Sensitive Adhesive for Re-Release and Dicing Die-Bonding Film
App 20130273361 - KAMIYA; Katsuhiko ; et al. | 2013-10-17 |
Pressure-sensitive Adhesive, Pressure-sensitive Adhesive Layer, And Pressure-sensitive Adhesive Sheet
App 20130251990 - HIGASHI; Masatsugu ; et al. | 2013-09-26 |
Pressure-sensitive Adhesive Layer For Transparent Conductive Film, Transparent Conductive Film With Pressure-sensitive Adhesive Layer, Transparent Conductive Laminate, And Touch Panel
App 20130141879 - TANAKA; Akiko ; et al. | 2013-06-06 |
Aqueous Dispersion Pressure-sensitive Adhesive Composition And Pressure-sensitive Adhesive Sheet
App 20120277368 - KOSO; Masatsugu ; et al. | 2012-11-01 |
Dicing die-bonding film
Grant 8,119,236 - Kamiya , et al. February 21, 2 | 2012-02-21 |
Active Energy Ray-curable Pressure-sensitive Adhesive For Re-release And Dicing Die-bonding Film
App 20120003470 - KAMIYA; Katsuhiko ; et al. | 2012-01-05 |
Dicing/die Bonding Film
App 20110104873 - Kamiya; Katsuhiko ; et al. | 2011-05-05 |
Dicing/die Bonding Film
App 20110053346 - Matsumura; Takeshi ; et al. | 2011-03-03 |
Dicing die-bonding film and process for producing semiconductor device
Grant 7,880,316 - Ootake , et al. February 1, 2 | 2011-02-01 |
Laminated Film And Process For Producing Semiconductor Device
App 20100279109 - OOTAKE; Hironao ; et al. | 2010-11-04 |
Laminated Film And Process For Producing Semiconductor Device
App 20100279468 - OOTAKE; Hironao ; et al. | 2010-11-04 |
Laminated Film And Process For Producing Semiconductor Device
App 20100279050 - Ootake; Hironao ; et al. | 2010-11-04 |
Dicing Die-bonding Film
App 20100239866 - Matsumura; Takeshi ; et al. | 2010-09-23 |
Dicing Die-bonding Film
App 20100233409 - Kamiya; Katsuhiko ; et al. | 2010-09-16 |
Dicing Die-bonding Film And Process For Producing Semiconductor Device
App 20100129987 - KAMIYA; Katsuhiko ; et al. | 2010-05-27 |
Dicing Die-bonding Film And Process For Producing Semiconductor Device
App 20100129989 - Kamiya; Katsuhiko ; et al. | 2010-05-27 |
Dicing Die-bonding Film And Process For Producing Semiconductor Device
App 20100129985 - OOTAKE; Hironao ; et al. | 2010-05-27 |
Dicing Die-bonding Film And Process For Producing Semiconductor Device
App 20100129986 - KAMIYA; Katsuhiko ; et al. | 2010-05-27 |
Dicing Die-bonding Film And Process For Producing Semiconductor Device
App 20100129988 - OOTAKE; Hironao ; et al. | 2010-05-27 |
Dicing Die-bonding Film
App 20100029061 - Kamiya; Katsuhiko ; et al. | 2010-02-04 |
Dicing Die-bonding Film
App 20100028687 - Kamiya; Katsuhiko ; et al. | 2010-02-04 |
Dicing Die-bonding Film
App 20100029059 - Matsumura; Takeshi ; et al. | 2010-02-04 |
Dicing Die-bonding Film
App 20100029060 - Kamiya; Katsuhiko ; et al. | 2010-02-04 |
Dicing Die-bonding Film
App 20090209089 - Murata; Shuuhei ; et al. | 2009-08-20 |
Removable water-dispersible acrylic adhesive composition and adhesive sheet
Grant 7,491,772 - Kamiya , et al. February 17, 2 | 2009-02-17 |
Removable water-dispersible acrylic adhesive compositiion and adhesive sheet
App 20070148444 - Kamiya; Katsuhiko ; et al. | 2007-06-28 |
Pressure sensitive adhesive optical film and image viewing display
Grant 7,160,611 - Banba , et al. January 9, 2 | 2007-01-09 |
Pressure sensitive adhesive optical film and image viewing display
App 20030198807 - Banba, Tomohide ; et al. | 2003-10-23 |
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