KAMIYA; Daisuke

Patent Applications and Registrations

Patent applications and USPTO patent grants for KAMIYA; Daisuke.The latest application filed is for "method of producing resin modifier, resin modifier, and composite material".

Company Profile

1.1.8

KAMIYA; Daisuke - Minato-ku Tokyo
Kamiya; Daisuke - Kyoto JP
KAMIYA; Daisuke - Minato-ku Tokyo
Kamiya; Daisuke - Aichi JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method Of Producing Resin Modifier, Resin Modifier, And Composite Material App 20220186015 - KAMIYA; Daisuke ; et al.	2022-06-16
Oxidized Cellulose, Method of Producing Oxidized Cellulose and Nanocellulose, and Nanocellulose Dispersion App 20210301034 - KAMIYA; Daisuke ; et al.	2021-09-30
Method For Producing Enteric Neural Precursors App 20210198624 - Ikeya; Makoto ; et al.	2021-07-01
Method For Producing Cellulose Nanofibers App 20200270369 - KAMIYA; Daisuke ; et al.	2020-08-27
Fungicide For Agricultural And Horticultural Use Containing Inorganic Copper Compound As Active Ingredient App 20100178359 - Arimoto; Yutaka ; et al.	2010-07-15
Active energy radiation hardenable skin plaster composition and skin plaster App 20070004896 - Ito; Kenji ; et al.	2007-01-04
Radiation-curable pressure-sensitive adhesive composition and pressure-sensitive adhesive sheets App 20060182956 - Kamiya; Daisuke ; et al.	2006-08-17
Pressure-sensitive adhesive curable with active energy ray and pressure-sensitive adhesive sheet App 20050101683 - Kamiya, Daisuke ; et al.	2005-05-12
Heat-sensitive adhesive sheet Grant 6,368,707 - Kamiya , et al. April 9, 2	2002-04-09

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