Kamitamari; Tohru

Patent Applications and Registrations

Patent applications and USPTO patent grants for Kamitamari; Tohru.The latest application filed is for "method for forming a displacement tin alloy plated film, displacement tin alloy plating bath and method for maintaining a plating performance".

Company Profile

0.6.3

Kamitamari; Tohru - Hirakata JP
Kamitamari; Tohru - Osaka JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Electroless gold plating bath, electroless gold plating method and electronic parts Grant 7,988,773 - Kiso , et al. August 2, 2	2011-08-02
Electroless gold plating bath, electroless gold plating method and electronic parts Grant 7,985,285 - Kiso , et al. July 26, 2	2011-07-26
Method For Forming A Displacement Tin Alloy Plated Film, Displacement Tin Alloy Plating Bath And Method For Maintaining A Plating Performance App 20080173550 - KISO; Masayuki ; et al.	2008-07-24
Electroless gold plating bath, electroless gold plating method and electronic parts App 20080138506 - Kiso; Masayuki ; et al.	2008-06-12
Electroless gold plating bath, electroless gold plating method and electronic parts App 20080138507 - Kiso; Masayuki ; et al.	2008-06-12
Electroless nickel plating solution and method Grant 5,910,340 - Uchida , et al. June 8, 1	1999-06-08
Analysis of tin, lead or tin-lead alloy plating solution Grant 5,294,554 - Uchida , et al. March 15, 1	1994-03-15
Bath and method for the electroless plating of tin and tin-lead alloy Grant 5,266,103 - Uchida , et al. November 30, 1	1993-11-30
Process for electroless plating tin, lead or tin-lead alloy Grant 5,248,527 - Uchida , et al. September 28, 1	1993-09-28

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