Kamio; Kunimasa
Patent Applications and Registrations
Patent applications and USPTO patent grants for Kamio; Kunimasa.The latest application filed is for "thermosetting resin composition and a composite material comprising cured product and said resin composition and its matrix".
- Kamio; Kunimasa - Suita JP
- Kamio; Kunimasa - Osaka JP
- Kamio; Kunimasa - Toyonaka JP
| Patent | Date |
|---|---|
| Thermosetting resin composition and a composite material comprising cured product and said resin composition and its matrix Grant 5,300,592 - Kanagawa , et al. April 5, 1 | 1994-04-05 |
| Thermosetting resin composition composed of a polymaleimide compound, a phenolic novolac resin and an epoxy resin Grant 5,041,507 - Kanagawa , et al. August 20, 1 | 1991-08-20 |
| Imide compound and composition containing the same Grant 4,960,860 - Saito , et al. * October 2, 1 | 1990-10-02 |
| Low-viscosity epoxy resin, and fiber-reinforced composite material based on m-alkyl triglycidylaminophenols Grant 4,957,995 - Saito , et al. September 18, 1 | 1990-09-18 |
| Low-viscosity epoxy resin, and fiber-reinforced composite material from triglycidyl m-aminophenols Grant 4,900,848 - Saito , et al. February 13, 1 | 1990-02-13 |
| Epoxy resin composition Grant 4,855,339 - Saito , et al. August 8, 1 | 1989-08-08 |
| Thermosetting resin composition Grant 4,808,717 - Saito , et al. February 28, 1 | 1989-02-28 |
| Fiber-reinforced composite material Grant 4,794,148 - Nakamura , et al. December 27, 1 | 1988-12-27 |
| Thermosetting resin composition comprising a partly allylated novolac epoxy resin and bismaleimide Grant 4,755,569 - Kanagawa , et al. July 5, 1 | 1988-07-05 |
| Thermosettable heat-resistant resin compositions Grant 4,705,833 - Saito , et al. November 10, 1 | 1987-11-10 |
| Thermosetting resin composition of an allylated novolak and a bis-maleimide Grant 4,632,966 - Kanagawa , et al. December 30, 1 | 1986-12-30 |
| Phosphinylmethyl polypenols and polyglycidyl ethers thereof Grant 4,621,123 - Takagishi , et al. November 4, 1 | 1986-11-04 |
| Epoxy resin composition Grant 4,529,790 - Kamio , et al. July 16, 1 | 1985-07-16 |
| Conductive paste Grant 4,410,457 - Fujimura , et al. October 18, 1 | 1983-10-18 |
| Oligomerization of m-isopropenylphenol Grant 4,408,086 - Matsushima , et al. October 4, 1 | 1983-10-04 |
| Curable composition Grant 4,360,649 - Kamio , et al. November 23, 1 | 1982-11-23 |
| Oligomerization of m-isopropenylphenol Grant 4,260,831 - Matsushima , et al. April 7, 1 | 1981-04-07 |
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