Kamikoriyama; Yoichi
Patent Applications and Registrations
Patent applications and USPTO patent grants for Kamikoriyama; Yoichi.The latest application filed is for "bonding junction structure".
- Kamikoriyama; Yoichi - Saitama JP
- Kamikoriyama; Yoichi - Ageo N/A JP
- Kamikoriyama; Yoichi - Ageo-shi JP
| Patent | Date |
|---|---|
| Copper powder and conductive composition containing same Grant 10,994,331 - Kamikoriyama , et al. May 4, 2 | 2021-05-04 |
| Copper power and method for producing same Grant 10,518,323 - Kamikoriyama , et al. Dec | 2019-12-31 |
| Bonding junction structure Grant 10,340,154 - Kamikoriyama , et al. | 2019-07-02 |
| Bonding Junction Structure App 20180269074 - KAMIKORIYAMA; Yoichi ; et al. | 2018-09-20 |
| Copper Powder And Conductive Composition Containing Same App 20180079001 - KAMIKORIYAMA; Yoichi ; et al. | 2018-03-22 |
| Conductor Connection Structure, Method For Producing Same, Conductive Composition, And Electronic Component Module App 20170140847 - KAMIKORIYAMA; Yoichi ; et al. | 2017-05-18 |
| Copper Powder And Method For Producing Same App 20150266090 - Kamikoriyama; Yoichi ; et al. | 2015-09-24 |
| Nickel ink and conductor film formed of nickel ink Grant 8,486,306 - Kamikoriyama , et al. July 16, 2 | 2013-07-16 |
| Conductive ink Grant 8,043,535 - Kamikoriyama , et al. October 25, 2 | 2011-10-25 |
| Nickel ink Grant 8,012,378 - Kamikoriyama , et al. September 6, 2 | 2011-09-06 |
| Electrically Conductive Ink App 20100155103 - Kamikoriyama; Yoichi ; et al. | 2010-06-24 |
| Conductive ink App 20090293766 - Kamikoriyama; Yoichi ; et al. | 2009-12-03 |
| Nickel Ink And Conductor Film Formed Of Nickel Ink App 20090252924 - Kamikoriyama; Yoichi ; et al. | 2009-10-08 |
| Nickel Ink App 20090053525 - Kamikoriyama; Yoichi ; et al. | 2009-02-26 |
| Carrier for electrophotographic developer and two-component electrophotographic developer Grant 7,476,483 - Kamikoriyama , et al. January 13, 2 | 2009-01-13 |
| Conductive Ink App 20080134936 - Kamikoriyama; Yoichi ; et al. | 2008-06-12 |
| Conductive Paste and Flexible Printed Wiring Board Produced Using the Conductive Paste App 20070256857 - Kamikoriyama; Yoichi ; et al. | 2007-11-08 |
| Carrier for electrophotography developers, developer prepared by using the carrier and method for forming image Grant 7,288,355 - Kamikoriyama , et al. October 30, 2 | 2007-10-30 |
| Carrier for electrophotographic developer and two-component electrophotographic developer App 20060121386 - Kamikoriyama; Yoichi ; et al. | 2006-06-08 |
| Carrier for electrophotography developers, developer prepared by using the carrier and method for forming image App 20040248015 - Kamikoriyama, Yoichi ; et al. | 2004-12-09 |
| Aqueous nickel slurry, method for preparing the same and conductive paste Grant 6,746,628 - Kamikoriyama , et al. June 8, 2 | 2004-06-08 |
| Aqueous nickel slurry, method for preparing the same and conductive paste App 20030001142 - Kamikoriyama, Yoichi ; et al. | 2003-01-02 |
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