Kamigawa; Hideyasu
Patent Applications and Registrations
Patent applications and USPTO patent grants for Kamigawa; Hideyasu.The latest application filed is for "apparatus for manufacturing laminated electrode body".
- Kamigawa; Hideyasu - Nagaokakyo JP
- Kamigawa; Hideyasu - Nagaokakyo-shi
| Patent | Date |
|---|---|
| Cutting device Grant 11,090,827 - Yamamoto , et al. August 17, 2 | 2021-08-17 |
| Manufacturing apparatus for electrode laminate Grant 11,063,301 - Fujiwake , et al. July 13, 2 | 2021-07-13 |
| Conveying device Grant 10,991,968 - Kamigawa , et al. April 27, 2 | 2021-04-27 |
| Manufacturing apparatus for electrode laminate Grant 10,985,408 - Fujiwake , et al. April 20, 2 | 2021-04-20 |
| Apparatus For Manufacturing Laminated Electrode Body App 20200373606 - Kamigawa; Hideyasu ; et al. | 2020-11-26 |
| Conveying Device App 20200161693 - Kamigawa; HIDEYASU ; et al. | 2020-05-21 |
| Cutting Device App 20200156276 - Yamamoto; Takeshi ; et al. | 2020-05-21 |
| Electrode Pressure-bonding Device App 20200153027 - SUMITA; MASAYUKI ; et al. | 2020-05-14 |
| Manufacturing Device For Electrode Assembly App 20200152944 - Sumita; MASAYUKI ; et al. | 2020-05-14 |
| Manufacturing Apparatus For Electrode Laminate App 20190252730 - Fujiwake; Koichiro ; et al. | 2019-08-15 |
| Manufacturing Apparatus For Electrode Laminate App 20190252729 - Fujiwake; Koichiro ; et al. | 2019-08-15 |
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