Kameyama; Michio

Patent Applications and Registrations

Patent applications and USPTO patent grants for Kameyama; Michio.The latest application filed is for "semiconductor device and method of patternning resin insulation layer on substrate of the same".

Company Profile

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Kameyama; Michio - Toyota N/A JP
Kameyama; Michio - Toyota-city JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Electric discharge machine and method of producing nozzle body using the same Grant 8,525,064 - Itoh , et al. September 3, 2	2013-09-03
Semiconductor device and method of patterning resin insulation layer on substrate of the same Grant 8,405,218 - Tomisaka , et al. March 26, 2	2013-03-26
Semiconductor Device And Method Of Patternning Resin Insulation Layer On Substrate Of The Same App 20110198733 - Tomisaka; Manabu ; et al.	2011-08-18
Electric Discharge Machine And Method Of Producing Nozzle Body Using The Same App 20110186551 - ITOH; Akira ; et al.	2011-08-04
Method and device for removing burr by high-density energy beam App 20060065648 - Kameyama; Michio ; et al.	2006-03-30
Laser beam machining equipment and method for machining by using laser beam App 20050230370 - Kameyama, Michio ; et al.	2005-10-20
High density energy beam machining method and apparatus for the same Grant 6,495,796 - Fukaya , et al. December 17, 2	2002-12-17
High density energy beam machining method and apparatus for the same App 20020023905 - Fukaya, Terukazu ; et al.	2002-02-28
Combined display panel Grant 6,181,301 - Inoguchi , et al. January 30, 2	2001-01-30

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