Kameyama; Kojiro

Patent Applications and Registrations

Patent applications and USPTO patent grants for Kameyama; Kojiro.The latest application filed is for "mobile terminal power receiving module utilizing wireless power transmission and mobile terminal rechargable battery including mobile terminal power receiving module".

Company Profile

0.15.16

Kameyama; Kojiro - Ota N/A JP
Kameyama; Kojiro - Ibaraki-shi JP
KAMEYAMA; Kojiro - Osaka JP
Kameyama; Kojiro - Gunma JP
KAMEYAMA; Kojiro - Otas-shi JP
Kameyama; Kojiro - Ota-Shi JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method of manufacturing semiconductor device with through hole Grant 9,165,898 - Kameyama , et al. October 20, 2	2015-10-20
Mobile Terminal Power Receiving Module Utilizing Wireless Power Transmission And Mobile Terminal Rechargable Battery Including Mobile Terminal Power Receiving Module App 20130175984 - Yamazaki; Hiroshi ; et al.	2013-07-11
Conductive Adhesive Sheet, Method For Producing The Same, Collector Electrode, And Solar Cell Module App 20130139874 - YAMAZAKI; Hiroshi ; et al.	2013-06-06
Electrode structure and semiconductor device Grant 8,154,129 - Okada , et al. April 10, 2	2012-04-10
Method of manufacturing a semiconductor device with a peeling prevention layer Grant 7,906,430 - Umemoto , et al. March 15, 2	2011-03-15
Semiconductor device and manufacturing method thereof Grant 7,820,548 - Kameyama , et al. October 26, 2	2010-10-26
Manufacturing method of semiconductor device with a barrier layer and a metal layer Grant 7,759,247 - Kameyama , et al. July 20, 2	2010-07-20
Semiconductor device and manufacturing method of the same Grant 7,670,955 - Kameyama , et al. March 2, 2	2010-03-02
Semiconductor Device And Manufacturing Method Thereof App 20100044839 - Okada; Kikuo ; et al.	2010-02-25
Semiconductor device and method of manufacturing the same Grant 7,659,576 - Okada , et al. February 9, 2	2010-02-09
Semiconductor device with penetrating electrode Grant 7,646,100 - Kameyama , et al. January 12, 2	2010-01-12
Electrode Structure And Semiconductor Device App 20090315175 - Okada; Kikuo ; et al.	2009-12-24
Semiconductor device and manufacturing method of the same Grant 7,582,971 - Kameyama , et al. September 1, 2	2009-09-01
Method Of Manufacturing Semiconductor Device With Through Hole App 20090124078 - KAMEYAMA; Kojiro ; et al.	2009-05-14
Chucking method and processing method using the same Grant 7,495,881 - Kameyama , et al. February 24, 2	2009-02-24
Semiconductor device with via hole for electric connection Grant 7,485,967 - Kameyama , et al. February 3, 2	2009-02-03
Method Of Manufacturing A Semiconductor Device App 20080254618 - Umemoto; Mitsuo ; et al.	2008-10-16
Semiconductor Device and Method of Manufacturing the Same App 20080135870 - Okada; Kikuo ; et al.	2008-06-12
Semiconductor Device And Manufacturing Method Of The Same App 20080132038 - Kameyama; Kojiro ; et al.	2008-06-05
Semiconductor device with a peeling prevention layer Grant 7,382,037 - Umemoto , et al. June 3, 2	2008-06-03
Semiconductor device with a via hole having a diameter at the surface larger than a width of a pad electrode Grant 7,339,273 - Kameyama , et al. March 4, 2	2008-03-04
Semiconductor device and manufacturing method thereof App 20070254471 - Kameyama; Kojiro ; et al.	2007-11-01
Semiconductor device and manufacturing method thereof Grant 7,256,420 - Kameyama , et al. August 14, 2	2007-08-14
Semiconductor device and manufacturing method thereof App 20060202348 - Kameyama; Kojiro ; et al.	2006-09-14
Chucking method and processing method using the same App 20060120010 - Kameyama; Kojiro ; et al.	2006-06-08
Semiconductor device and manufacturing method of the same App 20060108691 - Kameyama; Kojiro ; et al.	2006-05-25
Semiconductor device and manufacturing method of the same App 20060108695 - Kameyama; Kojiro ; et al.	2006-05-25
Semiconductor device and manufacturing method of the same App 20060087042 - Kameyama; Kojiro ; et al.	2006-04-27
Semiconductor device manufacturing method of the same App 20060071342 - Umemoto; Mitsuo ; et al.	2006-04-06
Semiconductor device and manufacturing method thereof App 20060073696 - Kameyama; Kojiro ; et al.	2006-04-06

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