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Patent applications and USPTO patent grants for Kamei; Sawako.The latest application filed is for "electronic device with a cover assembly having an adhesion layer".
Patent | Date |
---|---|
Electronic device with a cover assembly having an adhesion layer Grant 11,269,374 - Rogers , et al. March 8, 2 | 2022-03-08 |
Electronic Device With A Cover Assembly Having An Adhesion Layer App 20210072789 - Rogers; Matthew S. ;   et al. | 2021-03-11 |
Sapphire cover for electronic devices Grant 10,691,169 - Mylvaganam , et al. | 2020-06-23 |
Sapphire Cover For Electronic Devices App 20180284843 - Mylvaganam; Jeffrey C. ;   et al. | 2018-10-04 |
Sapphire cover for electronic devices Grant 9,977,464 - Mylvaganam , et al. May 22, 2 | 2018-05-22 |
Sapphire Cover For Electronic Devices App 20160062405 - Mylvaganam; Jeffrey C. ;   et al. | 2016-03-03 |
Method of applying a coating to a substrate App 20020119259 - Kamei, Sawako ;   et al. | 2002-08-29 |
Water base adhesion promotor for polypropylene and method for coating to polypropylene materials using the promotor App 20010049409 - Kawano, Shinnosuke ;   et al. | 2001-12-06 |
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