Kamehara, Nobuo

Patent Applications and Registrations

Patent applications and USPTO patent grants for Kamehara, Nobuo.The latest application filed is for "bump-forming method using two plates and electronic device".

Company Profile

0.18.1

Kamehara, Nobuo - Kawasaki-shi JP
Kamehara; Nobuo - Isehara JP
Kamehara; Nobuo - Kawasaki JP
Kamehara; Nobuo - Machida JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Bump-forming method using two plates and electronic device App 20010018263 - Ochiai, Masayuki ; et al.	2001-08-30
Immersion cooling coolant Grant 6,193,905 - Yamada , et al. February 27, 2	2001-02-27
Method for fabricating solder bumps by forming solder balls with a solder ball forming member Grant 6,025,258 - Ochiai , et al. February 15, 2	2000-02-15
Piezoelectric device and method for fabricating the same, and ink jet printer head and method for fabricating the same Grant 5,962,955 - Tsukada , et al. October 5, 1	1999-10-05
Piezoelectric fluid pump Grant 5,906,481 - Ogawa , et al. May 25, 1	1999-05-25
Epoxy resin composition Grant 5,659,004 - Takigawa , et al. August 19, 1	1997-08-19
Process for forming solder balls on a plate having apertures using solder paste and transferring the solder balls to semiconductor device Grant 5,643,831 - Ochiai , et al. July 1, 1	1997-07-01
Process for preparing a multi-layer wiring board Grant 5,593,526 - Yokouchi , et al. January 14, 1	1997-01-14
Process for manufacturing multi-layer glass ceramic substrate Grant 5,458,709 - Kamezaki , et al. October 17, 1	1995-10-17
Immersion cooling coolant and electronic device using this coolant Grant 5,349,499 - Yamada , et al. September 20, 1	1994-09-20
Method for manufacturing an oxide superconducting circuit board by printing Grant 5,286,713 - Yokoyama , et al. February 15, 1	1994-02-15
Multi-layer wiring board Grant 5,275,889 - Yokouchi , et al. January 4, 1	1994-01-04
Multilayer deposition method for forming Pb-doped Bi-Sr-Ca-Cu-O Superconducting films Grant 5,141,917 - Tanaka , et al. August 25, 1	1992-08-25
Production and use of coolant in cryogenic devices Grant 5,038,571 - Yokouchi , et al. August 13, 1	1991-08-13
Multilayer ceramic circuit board Grant 4,761,325 - Kurihara , et al. August 2, 1	1988-08-02
Method for producing a multilayer ceramic circuit board Grant 4,642,148 - Kurihara , et al. February 10, 1	1987-02-10
Method for producing multilayered glass-ceramic structure with copper-based conductors therein Grant 4,504,339 - Kamehara , et al. March 12, 1	1985-03-12
Method of forming a ceramic circuit substrate Grant 4,346,516 - Yokouchi , et al. August 31, 1	1982-08-31
Multilayer circuit boards Grant 4,313,026 - Yamada , et al. January 26, 1	1982-01-26

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