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Kambe; Rokuro Patent Filings

Kambe; Rokuro

Patent Applications and Registrations

Patent applications and USPTO patent grants for Kambe; Rokuro.The latest application filed is for "multilayer wiring substrate, and method of producing same".

Company Profile
0.4.5
  • Kambe; Rokuro - Nagoya JP
  • Kambe; Rokuro - Kagoya JP
  • Kambe, Rokuro - Nagoya-shi JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Multilayer wiring substrate, and method of producing same
Grant 7,233,066 - Kata , et al. June 19, 2
2007-06-19
Multilayer wiring substrate, and method of producing same
App 20060189125 - Kata; Keiichiro ;   et al.
2006-08-24
Multilayer wiring substrate, and method of producing same
Grant 7,060,604 - Kata , et al. June 13, 2
2006-06-13
Intermediate substrate
Grant 7,002,075 - Kambe , et al. February 21, 2
2006-02-21
Intermediate substrate
Grant 6,979,890 - Kambe , et al. December 27, 2
2005-12-27
Intermediate Substrate
App 20050263867 - Kambe, Rokuro ;   et al.
2005-12-01
Intermediate substrate
App 20050207091 - Kambe, Rokuro ;   et al.
2005-09-22
Wiring substrate, process for manufacturing the wiring substrate, and carrier sheet for green sheet used in the manufacturing process
App 20050032258 - Katagiri, Hiroshi ;   et al.
2005-02-10
Multilayer wiring substrate, and method of producing same
App 20040053489 - Kata, Keiichiro ;   et al.
2004-03-18

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