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Patent applications and USPTO patent grants for Kamakura; Takuro.The latest application filed is for "method of forming functional coating film between fine electric conductive circuits".
Patent | Date |
---|---|
Method of forming functional coating film between fine electric conductive circuits Grant 4,873,175 - Suzuki , et al. October 10, 1 | 1989-10-10 |
Flexible cicuit substrate with electroconductive adhesive layer and its production Grant 4,844,784 - Suzuki , et al. July 4, 1 | 1989-07-04 |
Method of forming functional films on fine transparent electric conductive circuit pattern and spaces thereof Grant 4,812,387 - Suzuki , et al. March 14, 1 | 1989-03-14 |
Method for selectively bonding substrate having fine electroconductive pattern Grant 4,676,854 - Suzuki , et al. June 30, 1 | 1987-06-30 |
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