KAMAI; Masayoshi
Patent Applications and Registrations
Patent applications and USPTO patent grants for KAMAI; Masayoshi.The latest application filed is for "metal material solid-phase bonding method and solid-phase bonding device".
- KAMAI; Masayoshi - Suita-shi JP
- Kamai; Masayoshi - Kobe JP
- Kamai; Masayoshi - Hyogo JP
| Patent | Date |
|---|---|
| Metal Material Solid-phase Bonding Method And Solid-phase Bonding Device App 20210107087 - FUJII; Hidetoshi ; et al. | 2021-04-15 |
| High frequency power supply device and plasma generator Grant 7,567,037 - Setsuhara , et al. July 28, 2 | 2009-07-28 |
| High frequency power supply device and plasma generator App 20060057854 - Setsuhara; Yuichi ; et al. | 2006-03-16 |
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