Kamada; Hiroyuki

Patent Applications and Registrations

Patent applications and USPTO patent grants for Kamada; Hiroyuki.The latest application filed is for "silicon carbide semiconductor device".

Company Profile

2.13.21

Kamada; Hiroyuki - Osaka JP
Kamada; Hiroyuki - Nishigo-mura JP
Kamada; Hiroyuki - Nishishirakawa-gun JP
Kamada; Hiroyuki - Nishishirakawa JP
Kamada; Hiroyuki - Toyama JP
Kamada; Hiroyuki - Takanezawa-machi JP
Kamada; Hiroyuki - Niigata JP
Kamada; Hiroyuki - Osaka-shi JP
Kamada; Hiroyuki - Shioya-gun JP
Kamada; Hiroyuki - Jouetsu-shi JP
Kamada; Hiroyuki - Muko JP
Kamada, Hiroyuki - Muko-shi JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Silicon carbide semiconductor device Grant 11,081,556 - Kamada August 3, 2	2021-08-03
Silicon Carbide Semiconductor Device App 20200251564 - Kind Code	2020-08-06
Method for controlling resistivity and N-type silicon single crystal Grant 10,400,353 - Hoshi , et al. Sep	2019-09-03
Method for heat treatment of silicon single crystal wafer Grant 10,066,322 - Hoshi , et al. September 4, 2	2018-09-04
Method for heat treatment of silicon single crystal wafer Grant 9,938,640 - Hoshi , et al. April 10, 2	2018-04-10
Method for heat treatment of silicon single crystal wafer Grant 9,850,595 - Hoshi , et al. December 26, 2	2017-12-26
Method For Heat Treatment Of Silicon Single Crystal Wafer App 20170342596 - HOSHI; Ryoji ; et al.	2017-11-30
Method for evaluating concentration of defect in silicon single crystal substrate Grant 9,773,710 - Kamada , et al. September 26, 2	2017-09-26
Method For Controlling Resistivity And N-type Silicon Single Crystal App 20170260645 - HOSHI; Ryoji ; et al.	2017-09-14
Method for manufacturing a defect-controlled low-oxygen concentration silicon single crystal wafer Grant 9,650,725 - Hoshi , et al. May 16, 2	2017-05-16
Method For Heat Treatment Of Silicon Single Crystal Wafer App 20170037541 - HOSHI; Ryoji ; et al.	2017-02-09
Method For Heat Treatment Of Silicon Single Crystal Wafer App 20170002480 - HOSHI; Ryoji ; et al.	2017-01-05
Method For Evaluating Concentration Of Defect In Silicon Single Crystal Substrate App 20160300768 - KAMADA; Hiroyuki ; et al.	2016-10-13
Method for evaluating silicon single crystal and method for manufacturing silicon single crystal Grant 9,111,883 - Hoshi , et al. August 18, 2	2015-08-18
Method For Manufacturing Silicon Single Crystal Wafer App 20150020728 - Hoshi; Ryoji ; et al.	2015-01-22
Method For Calculating Nitrogen Concentration In Silicon Single Crystal And Method For Calculating Resistivity Shift Amount App 20140379276 - Hoshi; Ryoji ; et al.	2014-12-25
Method For Evaluating Silicon Single Crystal And Method For Manufacturing Silicon Single Crystal App 20140363904 - Hoshi; Ryoji ; et al.	2014-12-11
Silica Glass Crucible, Method For Manufacturing Same, And Method For Manufacturing Silicon Single Crystal App 20130340671 - Kimura; Akihiro ; et al.	2013-12-26
Silicon Single Crystal Wafer App 20130323153 - Hoshi; Ryoji ; et al.	2013-12-05
Fabrication method of semiconductor device Grant 8,247,875 - Kamada August 21, 2	2012-08-21
Fabrication Method Of Semiconductor Device App 20110049644 - KAMADA; Hiroyuki	2011-03-03
Fabrication method of semiconductor device Grant 7,851,316 - Kamada December 14, 2	2010-12-14
Fabrication Method Of Semiconductor Device App 20090191682 - KAMADA; Hiroyuki	2009-07-30
Printed circuit board Grant 7,544,899 - Kamada , et al. June 9, 2	2009-06-09
Semiconductor device fabrication method and semiconductor device fabrication system for minimizing film-thickness variations Grant 7,294,569 - Kamada November 13, 2	2007-11-13
Manufacturing method for semiconductor device and rapid thermal annealing apparatus App 20060183290 - Kamada; Hiroyuki ; et al.	2006-08-17
Printed circuit board App 20060125081 - Kamada; Hiroyuki ; et al.	2006-06-15
Semiconductor device and manufacturing method thereof App 20060076558 - Morita; Kiyoyuki ; et al.	2006-04-13
Polishing method, polishing system and process-managing system Grant 6,914,000 - Kamada July 5, 2	2005-07-05
Semiconductor device fabrication method and semiconductor device fabrication system App 20050014377 - Kamada, Hiroyuki	2005-01-20
Polishing method, polishing system and process-managing system App 20030068889 - Kamada, Hiroyuki	2003-04-10

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