| Patent | Date |
|---|
Package with component connected with carrier via spacer particles
Grant 11,094,619 - Schindler , et al. August 17, 2 | 2021-08-17 |
Deposition of protective material at wafer level in front end for early stage particle and moisture protection
Grant 10,858,245 - Brandl , et al. December 8, 2 | 2020-12-08 |
Semiconductor sensor device and method for fabricating the same
Grant 10,818,805 - Kalz , et al. October 27, 2 | 2020-10-27 |
Package With Component Connected With Carrier Via Spacer Particles
App 20200043836 - Schindler; Manfred ; et al. | 2020-02-06 |
Package with component connected with carrier via spacer particles
Grant 10,438,878 - Schindler , et al. O | 2019-10-08 |
Deposition Of Protective Material At Wafer Level In Front End For Early Stage Particle And Moisture Protection
App 20190300362 - BRANDL; Florian ; et al. | 2019-10-03 |
Deposition of protective material at wafer level in front end for early stage particle and moisture protection
Grant 10,370,244 - Brandl , et al. | 2019-08-06 |
Deposition Of Protective Material At Wafer Level In Front End For Early Stage Particle And Moisture Protection
App 20190161345 - BRANDL; Florian ; et al. | 2019-05-30 |
Semiconductor device including antistatic die attach material
Grant 10,304,795 - Strutz , et al. | 2019-05-28 |
Semiconductor Sensor Device and Method for Fabricating the Same
App 20190148566 - Kalz; Franz-Peter ; et al. | 2019-05-16 |
Package With Component Connected With Carrier Via Spacer Particles
App 20180294210 - Schindler; Manfred ; et al. | 2018-10-11 |
Method for manufacturing a chip arrangement including a ceramic layer
Grant 9,984,897 - Mengel , et al. May 29, 2 | 2018-05-29 |
Semiconductor Device Including Antistatic Die Attach Material
App 20170352638 - Strutz; Volker ; et al. | 2017-12-07 |
Micromechanical semiconductor sensing device
Grant 9,790,086 - Kalz , et al. October 17, 2 | 2017-10-17 |
Semiconductor Device Including Antistatic Die Attach Material
App 20170256515 - Strutz; Volker ; et al. | 2017-09-07 |
Semiconductor device including antistatic die attach material
Grant 9,741,677 - Strutz , et al. August 22, 2 | 2017-08-22 |
Sensor device and method
Grant 9,728,652 - Elian , et al. August 8, 2 | 2017-08-08 |
Micromechanical semiconductor sensing device
Grant 9,567,211 - Kalz , et al. February 14, 2 | 2017-02-14 |
Electronic component
Grant 9,559,078 - Mahler , et al. January 31, 2 | 2017-01-31 |
Micromechanical Semiconductor Sensing Device
App 20170003180 - Kalz; Franz-Peter ; et al. | 2017-01-05 |
Chip Arrangement And A Method For Manufacturing A Chip Arrangement
App 20170004979 - Mengel; Manfred ; et al. | 2017-01-05 |
Chip package and chip assembly
Grant 9,530,754 - Hosseini , et al. December 27, 2 | 2016-12-27 |
Method for Electrophoretically Depositing a Film on an Electronic Assembly
App 20160240449 - Mahler; Joachim ; et al. | 2016-08-18 |
Method for electrophoretically depositing a film on an electronic assembly
Grant 9,313,897 - Mahler , et al. April 12, 2 | 2016-04-12 |
Chip Package And Chip Assembly
App 20160035700 - Hosseini; Khalil ; et al. | 2016-02-04 |
Method of manufacturing a chip package, chip package, method of manufacturing a chip assembly and chip assembly
Grant 9,159,701 - Hosseini , et al. October 13, 2 | 2015-10-13 |
Micromechanical Semiconductor Sensing Device
App 20150217994 - Kalz; Franz-Peter ; et al. | 2015-08-06 |
Device including two power semiconductor chips and manufacturing thereof
Grant 9,048,338 - Hosseini , et al. June 2, 2 | 2015-06-02 |
Micromechanical semiconductor sensing device
Grant 9,021,887 - Kalz , et al. May 5, 2 | 2015-05-05 |
Electronic Component
App 20150111343 - Mahler; Joachim ; et al. | 2015-04-23 |
Method Of Manufacturing A Chip Package, Chip Package, Method Of Manufacturing A Chip Assembly And Chip Assembly
App 20150076672 - Hosseini; Khalil ; et al. | 2015-03-19 |
Electronic component
Grant 8,947,886 - Mahler , et al. February 3, 2 | 2015-02-03 |
Method for attaching a metal surface to a carrier, a method for attaching a chip to a chip carrier, a chip-packaging module and a packaging module
Grant 8,912,450 - Mahler , et al. December 16, 2 | 2014-12-16 |
Chip Arrangement And A Method For Manufacturing A Chip Arrangement
App 20140197527 - Mengel; Manfred ; et al. | 2014-07-17 |
Chip Arrangement, A Method For Manufacturing A Chip Arrangement, Integrated Circuits And A Method For Manufacturing An Integrated Circuit
App 20140197552 - Otremba; Ralf ; et al. | 2014-07-17 |
Sensor with masking
App 20140116149 - DIEZ; Walter ; et al. | 2014-05-01 |
Method of Electrophoretic Depositing (EPD) a Film on a System and System Thereof
App 20140076613 - Mahler; Joachim ; et al. | 2014-03-20 |
Chip, method for producing a chip and device for laser ablation
Grant 8,564,026 - Kalz October 22, 2 | 2013-10-22 |
Sensor Device and Method
App 20130187201 - Elian; Klaus ; et al. | 2013-07-25 |
Micromechanical Semiconductor Sensing Device
App 20130152696 - Kalz; Franz-Peter ; et al. | 2013-06-20 |
Device Including Two Power Semiconductor Chips and Manufacturing Thereof
App 20130113114 - Hosseini; Khalil ; et al. | 2013-05-09 |
Electronic Component
App 20130021766 - Mahler; Joachim ; et al. | 2013-01-24 |
Method For Attaching A Metal Surface To A Carrier, A Method For Attaching A Chip To A Chip Carrier, A Chip-packaging Module And A Packaging Module
App 20120327614 - Mahler; Joachim ; et al. | 2012-12-27 |
Chip, Method For Producing A Chip And Device For Laser Ablation
App 20120074598 - Kalz; Franz-Peter | 2012-03-29 |
| 